Kwihlabathi elinobungcali lobuchwepheshe banamhlanje,iiwafers, ezaziwa ngokuba zii-silicon wafers, zezona zinto ziphambili kushishino lwe-semiconductor. Zisisiseko sokwenza izinto ezahlukeneyo ze-elektroniki ezifana nee-microprocessors, imemori, ii-sensors, njl.njl., kwaye i-wafer nganye ithwala amandla ezinto ezininzi ze-elektroniki. Kutheni ke sihlala sibona ii-wafers ezingama-25 ebhokisini? Kukho izinto zesayensi kunye noqoqosho lwemveliso yemizi-mveliso emva koku.
Ukutyhila isizathu sokuba kukho iiwafer ezingama-25 ebhokisini
Okokuqala, qonda ubungakanani be-wafer. Ubungakanani be-wafer eqhelekileyo buhlala buyi-intshi ezili-12 kunye ne-intshi ezili-15, nto leyo exhomekeke kwizixhobo ezahlukeneyo zokuvelisa kunye neenkqubo.Iiwafers eziyi-12 intshiokwangoku zezona zixhaphakileyo kuba zinokuthwala iitships ezininzi kwaye zilungelelene kakhulu kwixabiso lokuvelisa kunye nokusebenza kakuhle.
Inani "leziqwenga ezingama-25" alikho ngengozi. Lisekelwe kwindlela yokusika kunye nokusebenza kakuhle kokupakisha kwe-wafer. Emva kokuba i-wafer nganye ivelisiwe, kufuneka inqunyulwe ukuze kwenziwe iitships ezininzi ezizimeleyo. Ngokubanzi, i-I-wafer ye-intshi ezili-12ingasika amakhulu okanye amawaka eetships. Nangona kunjalo, ukuze kube lula ukulawula nokuthuthwa, ezi chips zihlala zipakishwa ngobuninzi obuthile, kwaye iziqwenga ezingama-25 ziyindlela eqhelekileyo yokukhetha ubungakanani kuba azinkulu kakhulu kwaye azinkulu kakhulu, kwaye zinokuqinisekisa uzinzo olwaneleyo ngexesha lokuthuthwa.
Ukongeza, ubungakanani beziqwenga ezingama-25 bukwanceda ekwenzeni umatshini wemveliso usebenze ngokuzenzekelayo. Ukuveliswa kweqela kunganciphisa iindleko zokucubungula isiqwenga esinye kwaye kuphucule ukusebenza kakuhle kwemveliso. Kwangaxeshanye, ukugcina nokuthutha, ibhokisi ye-wafer yeziqwenga ezingama-25 kulula ukuyisebenzisa kwaye inciphisa umngcipheko wokwaphuka.
Kubalulekile ukuqaphela ukuba ngokuqhubela phambili kwetekhnoloji, ezinye iimveliso ezikumgangatho ophezulu zinokusebenzisa inani elikhulu leepakeji, njengeziqwenga ezili-100 okanye ezingama-200, ukuphucula ngakumbi ukusebenza kakuhle kwemveliso. Nangona kunjalo, kwiimveliso ezininzi ezikumgangatho wabathengi kunye neziphakathi, ibhokisi ye-wafer enamaqhekeza angama-25 iseyindlela eqhelekileyo yokumisela.
Ngamafutshane, ibhokisi yeewafers idla ngokuba neziqwenga ezingama-25, nto leyo ehambelana neshishini le-semiconductor phakathi kokusebenza kakuhle kwemveliso, ulawulo lweendleko kunye nokulula kothutho. Ngophuhliso oluqhubekayo lwetekhnoloji, eli nani linokuhlengahlengiswa, kodwa ingqiqo esisiseko emva kwayo - ukwenza ngcono iinkqubo zemveliso kunye nokuphucula iingenelo zoqoqosho - ayitshintshi.
Iifab ze-wafer eziyi-intshi ezili-12 zisebenzisa i-FOUP kunye ne-FOSB, kwaye eziyi-intshi ezi-8 nangaphantsi (kuquka nee-intshi ezi-8) zisebenzisa iCassette, i-SMIF POD, kunye nebhokisi yenqanawa ye-wafer, oko kukuthi, eyi-intshi ezili-12.isithwali se-waferibizwa ngokuba yi-FOUP xa iyonke, kwaye i-8-intshiisithwali se-waferibizwa ngokuba yiCassette xa iyonke. Ngokwesiqhelo, iFOUP engenanto inobunzima obumalunga ne-4.2 kg, kwaye iFOUP egcwele iiwafer ezingama-25 inobunzima obumalunga ne-7.3 kg.
Ngokwengxelo yophando kunye nezibalo zeqela lophando lwe-QYResearch, intengiso yemarike yebhokisi ye-wafer yehlabathi ifikelele kwi-4.8 yeebhiliyoni zeerandi ngo-2022, kwaye kulindeleke ukuba ifikelele kwi-7.7 yeebhiliyoni zeerandi ngo-2029, kunye nezinga lokukhula lonyaka elihlanganisiweyo (CAGR) le-7.9%. Ngokweendidi zemveliso, i-semiconductor FOUP ithatha isabelo esikhulu kwimarike yonke, malunga ne-73%. Ngokweendidi zesicelo semveliso, esona sicelo sikhulu zii-wafers ze-intshi ezili-12, zilandelwe zii-wafers ze-intshi ezi-8.
Enyanisweni, kukho iintlobo ezininzi zeempahla zokuthwala iiwafer, ezifana neFOUP yokudlulisela iiwafer kwizityalo zokwenza iiwafer; iFOSB yokuthutha phakathi kwezityalo zokwenza iiwafer zesilicon kunye nezityalo zokwenza iiwafer; iiCassette carriers zingasetyenziselwa ukuthutha kunye nokusetyenziswa phakathi kweenkqubo.
IVULIWE IKHASETI
I-Open Cassette isetyenziswa kakhulu kwiinkqubo zokuthutha kunye nokucoca phakathi kweenkqubo kwimveliso ye-wafer. Njenge-FOSB, i-FOUP kunye nezinye izinto zokuthwala, ngokubanzi isebenzisa izixhobo ezingamelani nobushushu, ezineempawu ezintle zoomatshini, uzinzo olulinganayo, kwaye zihlala ixesha elide, azishukumi, azikhuphi igesi, azinamvula ingako, kwaye zinokuphinda zisetyenziswe. Ubungakanani obahlukeneyo be-wafer, ii-process nodes, kunye nezinto ezikhethiweyo kwiinkqubo ezahlukeneyo zahlukile. Izinto eziqhelekileyo yi-PFA, PTFE, PP, PEEK, PES, PC, PBT, PEI, COP, njl. Imveliso ngokubanzi iyilwe ngomthamo weziqwenga ezingama-25.
IKHASETI EVULEKILEYO ingasetyenziswa kunye nekhadibhodi ehambelanayoIkhasethi yeWaferiimveliso zokugcina iiwafer kunye nokuthuthwa phakathi kweenkqubo zokunciphisa ungcoliseko lweewafer.
I-Open Cassette isetyenziswa kunye neemveliso zeWafer Pod (OHT) ezenzelwe wena, ezingasetyenziswa ekudluliseni okuzenzakalelayo, ukufikelela okuzenzakalelayo kunye nokugcinwa okuvaliweyo phakathi kweenkqubo zokwenza iiwafer kunye nokwenza iitships.
Kakade ke, i-OPEN CASETTE inokwenziwa ngokuthe ngqo kwiimveliso ze-CASSETTE. Iibhokisi zoThutho zeWafer zemveliso zinesakhiwo esinjalo, njengoko kubonisiwe kumfanekiso ongezantsi. Ingahlangabezana neemfuno zothutho lwe-wafer ukusuka kwizityalo zokwenza i-wafer ukuya kwizityalo zokwenza ii-chips. I-CASSETTE kunye nezinye iimveliso ezivela kuyo ngokusisiseko zinokuhlangabezana neemfuno zothutho, ukugcinwa kunye nokuthuthwa phakathi kwemizi-mveliso phakathi kweenkqubo ezahlukeneyo kwiifektri ze-wafer kunye neefektri ze-chips.
Ibhokisi yoThutho yeWafer evulekileyo ngaphambili yeFOSB
Ibhokisi yoThutho yeWafer evulekayo ngaphambili iFOSB isetyenziselwa kakhulu ukuthutha iiwafers ezingama-intshi ezili-12 phakathi kwezityalo zokwenza iiwafers kunye nezityalo zokwenza iitships. Ngenxa yobukhulu obukhulu beewafers kunye neemfuno eziphezulu zokucoceka; iziqwenga zokubeka ezikhethekileyo kunye noyilo olungenakoyiswa zisetyenziselwa ukunciphisa ukungcola okubangelwa kukungqubana kwe-wafer displacement; izinto eziluhlaza zenziwe ngezinto ezikhupha igesi kancinci, ezinokunciphisa umngcipheko wokukhupha iiwafers ezingcolisayo. Xa kuthelekiswa nezinye iibhokisi zewafer zothutho, iFOSB inomoya oqinileyo. Ukongeza, kumzi-mveliso wokupakisha wangasemva, iFOSB ingasetyenziselwa ukugcina nokudlulisa iiwafers phakathi kweenkqubo ezahlukeneyo.
I-FOSB ngokubanzi yenziwa ibe ziingceba ezingama-25. Ukongeza ekugcinweni nasekufunyanweni kwezinto ngokuzenzekelayo ngeNkqubo yoLawulo lweZinto eziZenzekelayo (i-AMHS), ingasetyenziswa ngesandla.
I-Unified Pod evulekileyo ngaphambili
I-Front Opening Unified Pod (FOUP) isetyenziselwa kakhulu ukukhusela, ukuthutha kunye nokugcina ii-wafers kumzi-mveliso we-Fab. Sisikhongozeli esibalulekileyo sokuthwala inkqubo yokuhambisa ngokuzenzekelayo kumzi-mveliso we-wafer we-intshi ezili-12. Umsebenzi wayo obalulekileyo kukuqinisekisa ukuba zonke ii-wafers ezingama-25 zikhuselwe yiyo ukuze zingangcoliswa luthuli kwindawo engaphandle ngexesha lokudluliselwa phakathi komatshini ngamnye wokuvelisa, ngaloo ndlela zichaphazela isivuno. I-FOUP nganye ineepleyiti ezahlukeneyo zokudibanisa, iiphini kunye nemingxunya ukuze i-FOUP ibekwe kwindawo yokulayisha kwaye isebenze yi-AMHS. Isebenzisa izixhobo ezikhupha igesi encinci kunye nezixhobo zokufunxa umswakama omncinci, ezinokunciphisa kakhulu ukukhutshwa kweekhompawundi eziphilayo kwaye zithintele ungcoliseko lwe-wafer; kwangaxeshanye, umsebenzi ogqwesileyo wokutywina kunye nokunyuka kwamaxabiso unokubonelela ngendawo engaphantsi komswakama kwi-wafer. Ukongeza, i-FOUP ingayilwa ngemibala eyahlukeneyo, njengobomvu, i-orenji, emnyama, ecacileyo, njl.njl., ukuhlangabezana neemfuno zenkqubo kunye nokwahlula iinkqubo ezahlukeneyo kunye neenkqubo; ngokubanzi, i-FOUP yenzelwe abathengi ngokwemigca yemveliso kunye nomahluko womatshini womzi-mveliso we-Fab.
Ukongeza, i-POUP inokwenziwa ngokwezifiso kwiimveliso ezikhethekileyo zabavelisi bokupakisha ngokweenkqubo ezahlukeneyo ezifana ne-TSV kunye ne-FAN OUT kwiphakheji ye-chip back-end, efana ne-SLOT FOUP, i-297mm FOUP, njl. I-FOUP ingaphinda isetyenziswe, kwaye ixesha layo lokuphila liphakathi kweminyaka emi-2-4. Abavelisi be-FOUP banokubonelela ngeenkonzo zokucoca imveliso ukuhlangabezana neemveliso ezingcolisiweyo ukuze ziphinde zisetyenziswe.
Abathumeli beWafer abathe tye abangenanxibelelwano
I-Wafer Ethe tyaba Engenanxibelelwano Ii-Shippers zisetyenziswa kakhulu ekuthuthweni kwee-wafers ezigqityiweyo, njengoko kubonisiwe kumfanekiso ongezantsi. Ibhokisi yokuthutha ye-Entegris isebenzisa iringi yokuxhasa ukuqinisekisa ukuba ii-wafers azidibani ngexesha lokugcina nokuthuthwa, kwaye itywinwe kakuhle ukuthintela ukungcola, ukuguguleka, ukungqubana, imikrwelo, ukukhupha igesi, njl. Le mveliso ifanelekile kakhulu kwii-Thin 3D, iilensi okanye ii-wafers ezigobileyo, kwaye iindawo ezisetyenziswa kuzo ziquka ii-3D, 2.5D, MEMS, LED kunye nee-semiconductors zamandla. Le mveliso ixhotyiswe ngeeringi zokuxhasa ezingama-26, ezinomthamo we-wafer engama-25 (enobukhulu obahlukeneyo), kwaye ubungakanani be-wafer buquka i-150mm, 200mm kunye ne-300mm.
Ixesha leposi: Julayi-30-2024