Amfani da kayan aikin silicon carbide a cikin masana'antar semiconductor

Kayan da aka fi so don daidaitattun sassan injunan photolithography

A fannin semiconductor,yumbu mai siffar silicon carbideAna amfani da kayan aiki galibi a cikin kayan aiki masu mahimmanci don kera da'irori masu haɗawa, kamar teburin aiki na silicon carbide, layin jagora,masu nuna haske, tsotsa chick yumbu, hannaye, faifan niƙa, kayan aiki, da sauransu don injunan lithography.

Sassan yumbu na silicon carbidedon kayan aikin semiconductor da na gani

● Faifan niƙa na silicon carbide na yumbu. Idan faifan niƙa an yi shi ne da ƙarfe mai siminti ko ƙarfe mai carbon, tsawon rayuwarsa yana da gajeru kuma yawan faɗaɗa zafinsa yana da girma. A lokacin sarrafa wafers na silicon, musamman a lokacin niƙa ko gogewa mai sauri, lalacewa da nakasar zafi na faifan niƙa yana sa ya yi wahala a tabbatar da daidaito da daidaiton wafer ɗin silicon. Faifan niƙa da aka yi da tukwanen silicon carbide yana da tauri mai yawa da ƙarancin lalacewa, kuma ma'aunin faɗaɗa zafin yana daidai da na wafers na silicon, don haka ana iya niƙa shi a goge shi da sauri mai yawa.
● Kayan aikin yumbu na silicon carbide. Bugu da ƙari, lokacin da aka samar da wafers na silicon, suna buƙatar yin maganin zafi mai zafi kuma galibi ana jigilar su ta amfani da kayan aikin silicon carbide. Suna da juriya ga zafi kuma ba sa lalatawa. Ana iya shafa carbon mai kama da lu'u-lu'u (DLC) da sauran rufin da ke saman don haɓaka aiki, rage lalacewar wafer, da kuma hana gurɓatawa daga yaɗuwa.
● Teburin aiki na silicon carbide. Idan aka ɗauki teburin aiki a cikin injin lithography a matsayin misali, teburin aiki shine ke da alhakin kammala motsin fallasa, yana buƙatar motsi mai sauri, babban bugun jini, digiri shida na 'yanci na matakin nano mai cikakken daidaito. Misali, ga injin lithography mai ƙuduri na 100nm, daidaiton overlay na 33nm, da faɗin layi na 10nm, ana buƙatar daidaiton matsayi na teburin aiki don isa 10nm, saurin mask-silicon wafer da scanning a lokaci guda shine 150nm/s da 120nm/s bi da bi, kuma saurin duba abin rufe fuska yana kusa da 500nm/s, kuma ana buƙatar teburin aiki don samun daidaito da kwanciyar hankali mai girma.

Zane mai tsari na teburin aiki da teburin motsi mai motsi (sashi na ɓangare)

● Madubin murabba'in yumbu na silicon carbide. Mahimman abubuwan da ke cikin kayan aikin da'ira masu haɗaka kamar injunan lithography suna da siffofi masu rikitarwa, girma masu rikitarwa, da kuma tsarin da ba su da nauyi, wanda hakan ke sa ya zama da wahala a shirya irin waɗannan abubuwan da ke cikin yumbu na silicon carbide. A halin yanzu, manyan masana'antun kayan aikin da'ira na duniya, kamar ASML a Netherlands, NIKON da CANON a Japan, suna amfani da adadi mai yawa na kayan aiki kamar gilashin microcrystalline da cordierite don shirya madubai murabba'i, manyan abubuwan da ke cikin injunan lithography, kuma suna amfani da yumbu na silicon carbide don shirya wasu kayan aikin gini masu inganci tare da siffofi masu sauƙi. Duk da haka, ƙwararru daga Cibiyar Binciken Kayan Gine-gine ta China sun yi amfani da fasahar shiri ta musamman don cimma shirye-shiryen manyan madubai murabba'in silicon carbide masu girman girma, masu siffa mai rikitarwa, masu nauyi sosai, da sauran kayan aikin gani na gini da aiki don injunan lithography.