Ukusetyenziswa kweeseramikhi ze-silicon carbide kwintsimi ye-semiconductor

Izinto ezikhethwayo zokusetyenziswa kwezixhobo ezichanekileyo zoomatshini be-photolithography

Kwicandelo le-semiconductor,i-silicon carbide ceramicIzixhobo zisetyenziswa kakhulu kwizixhobo ezibalulekileyo zokwenza iisekethe ezidibeneyo, ezifana netafile yokusebenza ye-silicon carbide, iireli zesikhokelo,izibonisi, i-ceramic suction chuck, iingalo, iidiski zokugaya, izixhobo, njl.njl. zoomatshini be-lithography.

Iindawo ze-ceramic ze-silicon carbidekwizixhobo ze-semiconductor kunye ne-optical

● Idiski yokugaya ye-silicon carbide ceramic. Ukuba idiski yokugaya yenziwe ngentsimbi ephothiweyo okanye ngentsimbi yekhabhoni, ubomi bayo benkonzo bufutshane kwaye i-coefficient yayo yokwandisa ubushushu inkulu. Ngexesha lokucubungula ii-silicon wafers, ingakumbi ngexesha lokugaya okanye ukupolisha ngesantya esiphezulu, ukuguguleka kunye nokuguquguquka kobushushu bediski yokugaya kwenza kube nzima ukuqinisekisa ukuba i-silicon wafer iyaguquguquka kwaye iyahambelana. Idiski yokugaya eyenziwe ngee-silicon carbide ceramics inobunzima obuphezulu kunye nokuguguleka okuphantsi, kwaye i-coefficient yokwandisa ubushushu iyafana neyee-silicon wafers, ngoko ke inokugaywa kwaye ipolishwe ngesantya esiphezulu.
● Izinto ezenziwe nge-silicon carbide ceramic. Ukongeza, xa kuveliswa ii-silicon wafers, kufuneka ziphathwe ngobushushu obuphezulu kwaye zihlala zithuthwa kusetyenziswa izinto ezenziwe nge-silicon carbide. Azinabushushu kwaye azitshabalalisi. I-carbon efana nedayimani (DLC) kunye nezinye izinto zokugquma zinokufakwa kumphezulu ukuphucula ukusebenza, ukunciphisa umonakalo we-wafer, kunye nokuthintela ukusasazeka kongcoliseko.
● Itafile yokusebenza ye-silicon carbide. Xa sithatha itafile yokusebenza kumatshini we-lithography njengomzekelo, itafile yokusebenza inoxanduva olukhulu lokugqiba intshukumo yokuvezwa, ifuna intshukumo ye-nano-level ye-nano-precision ephezulu, enesantya esikhulu, ene-degree ezintandathu zenkululeko. Umzekelo, kumatshini we-lithography onesisombululo se-100nm, ukuchaneka kwe-overlay ye-33nm, kunye nobubanzi bomgca we-10nm, ukuchaneka kokubeka itafile yokusebenza kuyadingeka ukuze kufikelelwe kwi-10nm, isantya sokunyathela kunye nokuskena ngaxeshanye yi-150nm/s kunye ne-120nm/s ngokulandelelana, kwaye isantya sokuskena imaski sisondele kwi-500nm/s, kwaye itafile yokusebenza iyimfuneko ukuba ibe nokuchaneka okuphezulu kakhulu kokunyakaza kunye nokuzinza.

Umzobo wesicwangciso setafile yokusebenza kunye netafile yentshukumo encinci (icandelo eliyinxenye)

● Isipili sesikwere se-silicon carbide ceramic. Izinto eziphambili kwizixhobo eziphambili zesekethe ezidityanisiweyo ezifana noomatshini be-lithography zinemilo enzima, ubukhulu obunzima, kunye nezakhiwo ezikhaphukhaphu ezingenanto, okwenza kube nzima ukulungiselela ezo zinto ze-silicon carbide ceramic. Okwangoku, abavelisi bezixhobo zesekethe ezidityanisiweyo bamazwe ngamazwe, njenge-ASML eNetherlands, i-NIKON kunye ne-CANON eJapan, basebenzisa izixhobo ezininzi ezifana neglasi ye-microcrystalline kunye ne-cordierite ukulungiselela izibuko zesikwere, izinto eziphambili zoomatshini be-lithography, kwaye basebenzisa i-silicon carbide ceramics ukulungiselela ezinye izinto zesakhiwo ezisebenza kakuhle ezineemilo ezilula. Nangona kunjalo, iingcali ezivela kwi-China Building Materials Research Institute zisebenzise itekhnoloji yokulungiselela eyiyo ukufezekisa ukulungiswa kwezibuko zesikwere ze-silicon carbide ceramic ezinkulu, ezimile okwentsonkothileyo, ezikhaphukhaphu kakhulu, ezivalekileyo ngokupheleleyo kunye nezinye izinto zesakhiwo kunye nokusebenza kakuhle koomatshini be-lithography.