Ukusetshenziswa kwe-silicon carbide ceramics ensimini ye-semiconductor

Izinto ezikhethwayo zezingxenye ezinembile zemishini ye-photolithography

Ensimini ye-semiconductor,i-silicon carbide ceramicIzinto zokwakha zisetshenziswa kakhulu emishinini ebalulekile yokukhiqiza izifunda ezihlanganisiwe, njengetafula lokusebenza le-silicon carbide, imigqa yokuqondisa,izibonisi, i-ceramic suction chuck, izingalo, amadiski okugaya, izinto zokuhlobisa, njll. zemishini ye-lithography.

Izingxenye ze-ceramic ze-silicon carbidekwemishini ye-semiconductor kanye ne-optical

● Idiski yokugaya ye-silicon carbide ceramic. Uma idiski yokugaya yenziwe ngensimbi ephothiwe noma insimbi yekhabhoni, impilo yayo yesevisi imfushane futhi i-coefficient yayo yokukhulisa ukushisa inkulu. Ngesikhathi sokucubungula ama-wafer e-silicon, ikakhulukazi ngesikhathi sokugaya noma ukupholisha ngesivinini esikhulu, ukuguguleka kanye nokuguquguquka kokushisa kwediski yokugaya kwenza kube nzima ukuqinisekisa ukuthi i-wafer ye-silicon iyaguquguquka futhi iyafana. Idiski yokugaya eyenziwe nge-silicon carbide ceramics inobunzima obukhulu kanye nokuguguleka okuphansi, kanti i-coefficient yokukhulisa ukushisa ifana kakhulu neye-wafer ye-silicon, ngakho-ke ingagaywa futhi ipholishwe ngesivinini esikhulu.
● Izinto ezenziwe nge-silicon carbide ceramic. Ngaphezu kwalokho, lapho kukhiqizwa ama-wafer e-silicon, adinga ukwelashwa ngokushisa okuphezulu futhi avame ukuthuthwa kusetshenziswa izinto ezenziwe nge-silicon carbide. Azimelani nokushisa futhi azibhubhisi. I-carbon efana nedayimane (i-DLC) kanye nezinye izinto zokumboza zingasetshenziswa ebusweni ukuze kuthuthukiswe ukusebenza, kuncishiswe umonakalo we-wafer, futhi kuvinjelwe ukusabalala kokungcola.
● Ithebula lokusebenza le-silicon carbide. Uma sibheka ithebula lokusebenza emshinini we-lithography njengesibonelo, ithebula lokusebenza linesibopho esikhulu sokuqedela ukunyakaza kokuvezwa, okudinga ukunyakaza kwe-nano-level enembile kakhulu, okusheshayo okukhulu, okunezinga eliyisithupha lenkululeko. Isibonelo, emshinini we-lithography onesinqumo esingu-100nm, ukunemba kokumboza okungu-33nm, kanye nobubanzi bomugqa ongu-10nm, ukunemba kokubeka ithebula lokusebenza kuyadingeka ukuze kufinyelele ku-10nm, isivinini sokunyathela kanye nokuskena kwe-mask-silicon ngesikhathi esisodwa singama-150nm/s kanye nama-120nm/s ngokulandelana, kanti isivinini sokuskena imaski siseduze nama-500nm/s, futhi ithebula lokusebenza liyadingeka ukuthi libe nokunemba kokunyakaza okuphezulu kakhulu kanye nokuzinza.

Umdwebo wesimiso wethebula lokusebenza kanye netafula lokunyakaza okuncane (ingxenye encane)

● Isibuko sesikwele se-silicon carbide ceramic. Izingxenye ezibalulekile emishinini yesekethe ehlanganisiwe eyinhloko njengemishini ye-lithography zinezimo eziyinkimbinkimbi, ubukhulu obuyinkimbinkimbi, kanye nezakhiwo ezilula ezingenalutho, okwenza kube nzima ukulungiselela izingxenye ze-silicon carbide ceramic ezinjalo. Njengamanje, abakhiqizi bemishini yesekethe ehlanganisiwe yamazwe ngamazwe, njenge-ASML eNetherlands, i-NIKON kanye ne-CANON eJapane, basebenzisa inani elikhulu lezinto ezifana nengilazi ye-microcrystalline kanye ne-cordierite ukulungiselela izibuko zesikwele, izingxenye eziyinhloko zemishini ye-lithography, futhi basebenzisa i-silicon carbide ceramics ukulungiselela ezinye izingxenye zesakhiwo ezisebenza kahle kakhulu ezinezimo ezilula. Kodwa-ke, ochwepheshe abavela e-China Building Materials Research Institute basebenzise ubuchwepheshe bokulungiselela obukhethekile ukuze bafeze ukulungiswa kwezibuko zesikwele ze-silicon carbide ceramic ezinkulu, ezibunjwe ngendlela eyinkimbinkimbi, ezilula kakhulu, ezivalwe ngokuphelele kanye nezinye izingxenye zesakhiwo nezisebenzayo zemishini ye-lithography.