Kupaka ma wafer level package (FOWLP) ndi njira yotsika mtengo kwambiri mumakampani opanga ma semiconductor. Koma zotsatira zoyipa za njirayi ndi kupotoza ndi kusokoneza chip. Ngakhale kuti ukadaulo wa wafer level ndi panel level zikupitilirabe kusintha, mavuto awa okhudzana ndi kupanga zinthu akadalipo.
Kupindika kumachitika chifukwa cha kuchepa kwa mankhwala a liquid compression molding compound (LCM) panthawi yopopera ndi kuziziritsa pambuyo poumba. Chifukwa chachiwiri cha kupindika ndi kusalingana kwa coefficient of thermal expansion (CTE) pakati pa silicon chip, molding material, ndi substrate. Offset imachitika chifukwa chakuti zipangizo zopindika zokhala ndi filler yambiri nthawi zambiri zimagwiritsidwa ntchito pokhapokha kutentha kwambiri komanso kuthamanga kwambiri. Pamene chip imakhazikika pa chonyamulira kudzera mu bonding yanthawi yochepa, kutentha kowonjezereka kudzafewetsa guluu, motero kufooketsa mphamvu yake yomatira ndikuchepetsa kuthekera kwake kokonza chip. Chifukwa chachiwiri cha offset ndikuti kuthamanga komwe kumafunika pakuumba kumabweretsa kupsinjika pa chip chilichonse.
Pofuna kupeza mayankho a mavutowa, DELO inachita kafukufuku wotheka polumikiza chip chosavuta cha analog pa chonyamulira. Ponena za kukhazikitsa, chonyamuliracho chimakutidwa ndi guluu womangirira kwakanthawi, ndipo chipcho chimayikidwa pansi. Pambuyo pake, chonyamuliracho chinapangidwa pogwiritsa ntchito guluu wochepa wa DELO ndipo chinachiritsidwa ndi kuwala kwa ultraviolet musanachotse chonyamuliracho. Mu ntchito zotere, nthawi zambiri amagwiritsidwa ntchito zinthu zophatikizana zokhala ndi thermosetting molding.
DELO inayerekezanso kupotoza kwa zinthu zopangira thermosetting ndi zinthu zotsukidwa ndi UV mu kuyeseraku, ndipo zotsatira zake zinasonyeza kuti zinthu zopangira thermosetting zimapotoza panthawi yozizira pambuyo pa thermosetting. Chifukwa chake, kugwiritsa ntchito ultraviolet curing ya kutentha kwa chipinda m'malo mwa kutentha kungathandize kuchepetsa kwambiri kusagwirizana kwa thermal expansion coefficient pakati pa molding compound ndi chonyamulira, motero kuchepetsa kupindika kwakukulu momwe zingathere.
Kugwiritsa ntchito zinthu zoyeretsera za ultraviolet kungachepetsenso kugwiritsa ntchito zodzaza, motero kuchepetsa kukhuthala ndi modulus ya Young. Kukhuthala kwa guluu wa chitsanzo chomwe chinagwiritsidwa ntchito mu mayeso ndi 35000 mPa · s, ndipo modulus ya Young ndi 1 GPa. Chifukwa chosowa kutentha kapena kupanikizika kwakukulu pa zinthu zomangira, chip offset ikhoza kuchepetsedwa kwambiri momwe zingathere. Chomera chomangira chimakhala ndi kukhuthala kwa pafupifupi 800000 mPa · s ndi modulus ya Young m'mitundu iwiri.
Ponseponse, kafukufuku wasonyeza kuti kugwiritsa ntchito zipangizo zotsukidwa ndi UV popangira malo akuluakulu ndikothandiza popanga ma chip lead fan out wafer level packaging, komanso kuchepetsa warpage ndi chip offset momwe zingathere. Ngakhale kusiyana kwakukulu kwa ma thermal expansion coefficients pakati pa zipangizo zomwe zagwiritsidwa ntchito, njirayi ikadali ndi ntchito zambiri chifukwa chosakhala ndi kusintha kwa kutentha. Kuphatikiza apo, UV curing ingachepetsenso nthawi yotsukidwa ndi mphamvu zomwe zimagwiritsidwa ntchito.
UV m'malo mwa kutentha kumachepetsa kupotoka kwa tsamba ndi kusintha kwa kutentha kwa ma paketi okhala ndi fan-out wafer
Kuyerekeza ma wafer okhala ndi mainchesi 12 okhala ndi utoto pogwiritsa ntchito mankhwala oyeretsedwa bwino komanso odzaza kwambiri (A) ndi mankhwala oyeretsedwa ndi UV (B)
Nthawi yotumizira: Novembala-05-2024