Ukupakisha izinga le-wafer eliphuma kufeni (i-FOWLP) kuyindlela engabizi kakhulu embonini ye-semiconductor. Kodwa imiphumela emibi ejwayelekile yale nqubo ukugoba kanye nokususwa kwe-chip. Naphezu kokuthuthuka okuqhubekayo kobuchwepheshe bezinga le-wafer kanye nezinga lephaneli, lezi zinkinga ezihlobene nokubumba zisekhona.
Ukugoba kubangelwa ukuncishiswa kwamakhemikhali kwe-liquid compression molding compound (LCM) ngesikhathi sokuqina nokupholisa ngemva kokubumba. Isizathu sesibili sokugoba ukungalingani kwe-coefficient of thermal expansion (CTE) phakathi kwe-silicon chip, izinto zokubumba, kanye ne-substrate. Ukugoba kungenxa yokuthi izinto zokubumba eziqinile ezinokuqukethwe okuphezulu kokugcwalisa ngokuvamile zingasetshenziswa kuphela ngaphansi kokushisa okuphezulu kanye nokucindezela okuphezulu. Njengoba i-chip inamathele ku-carrier ngokubopha kwesikhashana, izinga lokushisa elikhulayo lizothambisa i-adhesive, ngaleyo ndlela yenze buthaka amandla ayo okunamathela futhi inciphise ikhono layo lokulungisa i-chip. Isizathu sesibili sokugoba ukuthi ingcindezi edingekayo yokubumba idala ukucindezeleka ku-chip ngayinye.
Ukuze kutholakale izixazululo zalezi zinselele, i-DELO yenze ucwaningo lokwenzeka ngokubopha i-chip elula ye-analog ku-carrier. Ngokuphathelene nokusethwa, i-carrier wafer imbozwa nge-bonding adhesive yesikhashana, bese i-chip ibekwa ibheke phansi. Ngemva kwalokho, i-wafer yabunjwa kusetshenziswa i-DELO adhesive ephansi futhi yalashwa ngemisebe ye-ultraviolet ngaphambi kokususa i-carrier wafer. Ezinhlelweni ezinjalo, ngokuvamile kusetshenziswa ama-composites e-thermosetting molding ane-viscosity ephezulu.
I-DELO iphinde yaqhathanisa i-warpage yezinto zokubumba ze-thermosetting kanye nemikhiqizo ekhanyisiwe ye-UV ekuhlolweni, futhi imiphumela ibonise ukuthi izinto zokubumba ezijwayelekile zizogoba ngesikhathi sokupholisa ngemva kokusetha i-thermosetting. Ngakho-ke, ukusebenzisa ukushisa kwe-ultraviolet ekamelweni esikhundleni sokushisa kunganciphisa kakhulu umthelela wokungafani kwe-thermal expansion coefficient phakathi kwe-molding compound kanye ne-carrier, ngaleyo ndlela kuncishiswe ukugoba ngezinga elikhulu ngangokunokwenzeka.
Ukusetshenziswa kwezinto zokupholisa ze-ultraviolet kunganciphisa nokusetshenziswa kwezigcwalisi, ngaleyo ndlela kunciphise i-viscosity kanye ne-Young's modulus. I-viscosity ye-adhesive yemodeli esetshenziswe esivivinyweni ingu-35000 mPa · s, kanti i-Young's modulus ingu-1 GPa. Ngenxa yokungabikho kokushisa noma ingcindezi ephezulu ezintweni zokubumba, i-chip offset ingancishiswa ngezinga elikhulu ngangokunokwenzeka. I-compound evamile yokubumba ino-viscosity engaba ngu-800000 mPa · s kanye ne-Young's modulus ebangeni lamadijithi amabili.
Sekukonke, ucwaningo lukhombisile ukuthi ukusebenzisa izinto eziqiniswe nge-UV ukuze kufakwe indawo enkulu kuzuzisa ekukhiqizeni ukupakisha kwezinga le-chip leader fan out wafer, kuyilapho kunciphisa i-warpage kanye ne-chip offset ngezinga elikhulu ngangokunokwenzeka. Naphezu komehluko omkhulu kuma-coefficients okwandisa ukushisa phakathi kwezinto ezisetshenziswayo, le nqubo isenezinhlelo eziningi ngenxa yokungabikho kokushintshashintsha kwezinga lokushisa. Ngaphezu kwalokho, ukwelapha nge-UV kunganciphisa isikhathi sokwelapha kanye nokusetshenziswa kwamandla.
I-UV esikhundleni sokushisa kunciphisa ukugoba kanye nokushintshashintsha kokufa kokupakisha kwezinga le-wafer eliphuma ku-fan-out
Ukuqhathaniswa kwama-wafer ambozwe ngamasentimitha angu-12 kusetshenziswa i-compound evuvukile ngokushisa, egcwele kakhulu (A) kanye ne-compound evuvukile nge-UV (B)
Isikhathi sokuthunyelwe: Novemba-05-2024