Kurongedza wafer level yefeni (FOWLP) inzira isingadhuri muindasitiri yesemiconductor. Asi mhedzisiro yakajairika yeiyi nzira ndeyekukombama uye kudzima chip. Pasinei nekuvandudzwa kuri kuramba kuchiitwa kwetekinoroji yewafer level uye panel level yefeni, matambudziko aya ane chekuita nekuumba achiripo.
Kukombama kunokonzerwa nekupwanyika kwemakemikari kwe liquid compression molding compound (LCM) panguva yekupisa nekutonhodza mushure mekukombama. Chikonzero chechipiri chekukombama kusawirirana mu coefficient of thermal expansion (CTE) pakati pesilicon chip, molding material, uye substrate. Offset imhaka yekuti viscous molding materials ine high filler content inogona kushandiswa chete kana paine tembiricha yakakwira uye pressure yakakwira. Sezvo chip ichisungirirwa kune carrier kuburikidza ne temporary bonding, kuwedzera tembiricha kuchanyorovesa adhesive, nokudaro zvichideredza simba rayo rekukombama uye zvichideredza kugona kwayo kugadzirisa chip. Chikonzero chechipiri che offset ndechekuti pressure inodiwa pakukombama inokonzera stress pa chip yega yega.
Kuti vawane mhinduro dzematambudziko aya, DELO yakaita ongororo yekugona kwayo nekubatanidza chip yakapfava yeanalog pacarrier. Panyaya yekugadzirisa, carrier wafer inoputirwa ne bonding adhesive yenguva pfupi, uye chip yacho inoiswa yakatarisa pasi. Mushure mezvo, wafer yakaumbwa uchishandisa low viscosity DELO adhesive uye yakaporeswa ne ultraviolet radiation isati yabviswa carrier wafer. Mukushandiswa kwakadaro, high viscosity thermosetting molding composites inowanzo shandiswa.
DELO yakaenzanisawo warpage yezvinhu zvekuumba zve thermosetting uye zvigadzirwa zvakagadziriswa neUV mukuyedza, uye mhedzisiro yakaratidza kuti zvinhu zvekuumba zvakajairika zvaizokombama panguva yekutonhora mushure me thermosetting. Naizvozvo, kushandisa ultraviolet curing yemukamuri panzvimbo pekupisa curing kunogona kuderedza zvakanyanya kukanganisa kwekusawirirana kwe thermal expansion coefficient pakati pe molding compound ne carrier, nokudaro zvichideredza warping zvakanyanya sezvinobvira.
Kushandiswa kwezvinhu zvinodzivirira ultraviolet kunogonawo kuderedza kushandiswa kwezvizadza, nokudaro zvichideredza viscosity uye Young's modulus. Viscosity yemuenzaniso weglue inoshandiswa mukuyedza i35000 mPa · s, uye Young's modulus i1 GPa. Nekuda kwekushaikwa kwekupisa kana kumanikidzwa kwakanyanya pachinhu chekuumba, chip offset inogona kuderedzwa zvakanyanya sezvinobvira. Musanganiswa wemuumbi wakajairika une viscosity inosvika 800000 mPa · s uye Young's modulus iri pakati pemadijiti maviri.
Zvose zvataurwa, tsvakiridzo yakaratidza kuti kushandisa zvinhu zvakagadziriswa neUV pakuumba nzvimbo yakakura kunobatsira pakugadzira chip leader fan out wafer level packaging, ukuwo kuchideredza warpage uye chip offset zvakanyanya sezvinobvira. Pasinei nekusiyana kukuru mu thermal expansion coefficients pakati pezvinhu zvinoshandiswa, maitiro aya achiri kushandiswa kakawanda nekuda kwekusavapo kwekuchinja kwekushisa. Pamusoro pezvo, UV curing inogonawo kuderedza nguva yekupisa uye kushandiswa kwesimba.
UV panzvimbo pekupisa kwemafuta inoderedza kupwanya uye kuchinja kwekuchinja kwemafuta mupakeji yefan-out wafer-level
Kuenzanisa mawafers ane ma inch 12 akafukidzwa uchishandisa compound inodziya, ine filler yakawanda (A) uye compound inodziya UV (B)
Nguva yekutumira: Mbudzi-05-2024