Gupakira ku rugero rwa wafer (FOWLP) ni uburyo buhendutse mu nganda za semiconductor. Ariko ingaruka mbi zisanzwe z'iyi gahunda ni ukugonga no gufunga ibice. Nubwo ikoranabuhanga rya wafer rikomeje kunozwa n'ikoranabuhanga rya wafer ku rwego rwa panel, ibi bibazo bijyanye no gushushanya biracyahari.
Kuziba kw'amazi guterwa no kugabanuka kwa shimi mu buryo bwa "liquid compression molding compound" (LCM) mu gihe cyo gukonjesha no gukonjesha nyuma yo kuziba. Impamvu ya kabiri yo kuziba kw'amazi guterwa ni ukudahuza kwa "coefficient of thermal expansion" (CTE) hagati ya "silicon chip", "molding material", na "substrate". Kuziba kw'amazi guterwa n'uko ibikoresho byo kuziba byuzuyemo amazi bifite "filler" nyinshi bishobora gukoreshwa gusa mu gihe cy'ubushyuhe bwinshi n'umuvuduko mwinshi. Uko "chip" ishyirwa ku gikoresho gifata ibintu binyuze mu gufatanya by'agateganyo, kwiyongera k'ubushyuhe bizoroshya "kolde", bityo bigatuma imbaraga zayo zo kuziba kw'amazi zigabanuka kandi ubushobozi bwayo bwo kuziba kw'amazi bugabanuka. Impamvu ya kabiri yo kuziba kw'amazi guterwa kw'amazi guterwa kw'amazi bugabanuka ni uko umuvuduko ukenewe mu kuziba kw'amazi utera stress kuri buri "chip".
Kugira ngo haboneke ibisubizo kuri izi mbogamizi, DELO yakoze inyigo y’uko ibintu bishoboka binyuze mu gufata chip yoroshye ya analog ku gikoresho gitwara. Mu bijyanye no gushyiraho, wafer yo gutwara irashyirwamo kole y’agateganyo yo gufata, hanyuma chip igashyirwa ireba hasi. Nyuma yaho, wafer yakozwe hakoreshejwe kole ya DELO ifite viscosity nke kandi igakira imirasire ya ultraviolet mbere yo gukuraho wafer yo gutwara. Muri ubwo buryo, ubusanzwe hakoreshwa ibintu bivanze na thermosetting molding.
DELO yanagereranije uburyo ibikoresho byo gushushanya thermosetting byakoreshejwe n'ibikoresho bya UV byasubijwe mu igerageza, kandi ibyavuye mu bushakashatsi byagaragaje ko ibikoresho bisanzwe byo gushushanya byahindagurikaga mu gihe cyo gukonja nyuma yo gushushanya thermosetting. Kubwibyo, gukoresha ultraviolet ultraviolet curring mu bushyuhe bw'icyumba aho gukoresha ultraviolet curring bishobora kugabanya cyane ingaruka z'ubushyuhe butaringaniye hagati y'ikintu cyo gushushanya n'icyuma gitwara, bityo bigagabanya ubushyuhe bushoboka.
Gukoresha ibikoresho bivura imirasire ya ultraviolet bishobora kandi kugabanya ikoreshwa ry'ibikoresho byo kuzura, bityo bikagabanya ubukana n'uburyo bwa Young's. Ubukana bw'uburyo bwa kole y'icyitegererezo yakoreshejwe mu igeragezwa ni 35000 mPa · s, naho uburyo bwa Young's ni 1 GPa. Bitewe n'uko nta bushyuhe cyangwa umuvuduko mwinshi ku bikoresho byo kubumba, chip offset ishobora kugabanuka ku rugero rushoboka. Imvange isanzwe yo kubumba ifite ubukana bwa 800000 mPa · s na modulus ya Young iri mu byiciro bibiri.
Muri rusange, ubushakashatsi bwagaragaje ko gukoresha ibikoresho bya UV byakuweho mu gushushanya ahantu hanini ari ingirakamaro mu gukora ipaki y’amashanyarazi ya chip leader out wafer level, mu gihe bigabanya warpage na chip offset ku buryo bushoboka. Nubwo hari itandukaniro rinini mu mibare y’ubushyuhe hagati y’ibikoresho byakoreshejwe, ubu buryo buracyafite ikoreshwa rinini bitewe n’uko nta hindagurika ry’ubushyuhe. Byongeye kandi, UV yakuweho ishobora no kugabanya igihe cyo kuyikuraho n’ingufu ikoreshwa.
UV aho gukoresha ubushyuhe bukabije bigabanya imihindagurikire y'ikirere no guhinduka kw'ingufu mu gupfunyika kw'imvange y'umuyaga uva mu kirere
Kugereranya utugati twa santimetero 12 dupfutse hakoreshejwe imvange ishyushye kandi yuzuye cyane (A) n'imvange ishyushye cyane (B)
Igihe cyo kohereza: Ugushyingo-05-2024