Ukupakisha i-wafer level level (FOWLP) yindlela engabizi kakhulu kwishishini le-semiconductor. Kodwa iziphumo ebezingalindelekanga eziqhelekileyo zale nkqubo kukugoba kunye nokunciphisa i-chip. Nangona uphuculo oluqhubekayo lwe-wafer level kunye ne-paneli level fan out technology, ezi ngxaki ezinxulumene nokubumba zisekhona.
Ukugoba kubangelwa kukuncitshiswa kweekhemikhali kwe-liquid compression molding compound (LCM) ngexesha lokucola nokupholisa emva kokugoba. Isizathu sesibini sokugoba kukungafani kwe-coefficient of thermal expansion (CTE) phakathi kwe-silicon chip, izinto zokugoba, kunye ne-substrate. Ukugoba kungenxa yokuba izinto zokugoba ezixineneyo ezinomxholo ophezulu wokuzalisa zingasetyenziswa kuphela phantsi kobushushu obuphezulu kunye noxinzelelo oluphezulu. Njengoko i-chip inamathele kwi-carrier ngokubophelela okwethutyana, ubushushu obukhulayo buya kuyithambisa i-adhesive, ngaloo ndlela buthathaka amandla ayo okugoba kwaye kunciphise amandla ayo okulungisa i-chip. Isizathu sesibini sokugoba kukuba uxinzelelo olufunekayo lokugoba ludala uxinzelelo kwi-chip nganye.
Ukuze kufunyanwe izisombululo kwezi ngxaki, i-DELO yenze uphando lokwenzeka ngokubopha itshiphusi elula ye-analog kwi-carrier. Ngokuphathelele ukuseta, i-carrier wafer igqunywa nge-bonding adhesive yexeshana, kwaye itshiphu ibekwe ijonge ezantsi. Emva koko, i-wafer yabunjwa kusetyenziswa i-DELO adhesive ephantsi kwaye yanyangwa ngemitha ye-ultraviolet ngaphambi kokuba isuswe i-carrier wafer. Kwizicelo ezinjalo, kusetyenziswa ii-composites ze-thermosetting molding ze-viscosity ephezulu.
I-DELO ikwathelekise i-warpage yezinto zokubumba ze-thermosetting kunye neemveliso ezicociweyo ze-UV kuvavanyo, kwaye iziphumo zibonise ukuba izinto zokubumba eziqhelekileyo ziya kugoba ngexesha lokuphola emva kwe-thermosetting. Ke ngoko, ukusebenzisa i-ultraviolet curing yobushushu begumbi endaweni yokufudumeza i-heat curing kunokunciphisa kakhulu impembelelo yokungafani kwe-thermal expansion coefficient phakathi kwe-molding compound kunye ne-carrier, ngaloo ndlela kunciphisa i-warping kangangoko kunokwenzeka.
Ukusetyenziswa kwezinto eziphilisa nge-ultraviolet kunokunciphisa ukusetyenziswa kwezizalisi, ngaloo ndlela kunciphisa i-viscosity kunye ne-Young's modulus. I-viscosity ye-adhesive yomzekelo esetyenzisiweyo kuvavanyo yi-35000 mPa · s, kwaye i-Young's modulus yi-1 GPa. Ngenxa yokungabikho kobushushu okanye uxinzelelo oluphezulu kwizinto zokubumba, i-chip offset inokuncitshiswa kangangoko kunokwenzeka. I-compound eqhelekileyo yokubumba ino-viscosity emalunga ne-800000 mPa · s kunye ne-Young's modulus kuluhlu lwamanani amabini.
Ngokubanzi, uphando lubonise ukuba ukusebenzisa izixhobo ezicociweyo ze-UV kwi-molding enkulu kuluncedo ekuveliseni ukupakisha kwe-chip leader fan out wafer level, ngelixa kunciphisa i-warpage kunye ne-chip offset kangangoko kunokwenzeka. Nangona kukho umahluko omkhulu kwi-thermal expansion coefficients phakathi kwezinto ezisetyenzisiweyo, le nkqubo isenezicelo ezininzi ngenxa yokungabikho kotshintsho kubushushu. Ukongeza, i-UV curing inokunciphisa ixesha lokucocwa kunye nokusetyenziswa kwamandla.
UV endaweni yokupholisa ngobushushu kunciphisa ukugoba kunye nokutshintsha kokutshintsha komgangatho we-wafer kwiphakheji ye-fan-out wafer
Ukuthelekiswa kwee-wafers ezigqunywe nge-intshi ezili-12 kusetyenziswa i-compound evuthwe ngobushushu, ene-high-filler (A) kunye ne-UV-cured compound (B)
Ixesha lokuthumela: Novemba-05-2024