Cov txheej txheem semiconductor ntws-Ⅱ

Txais tos rau peb lub vev xaib kom tau cov ntaub ntawv hais txog khoom thiab kev sab laj.

Peb lub vas sab hauv internet:https://www.vet-china.com/

 

Kev sib xyaw ntawm Poly thiab SiO2:

Tom qab qhov no, cov Poly thiab SiO2 ntau dhau raug etched tseg, uas yog, tshem tawm. Lub sijhawm no, kev taw qhiakev txiavsiv. Hauv kev faib tawm ntawm etching, muaj kev faib tawm ntawm kev taw qhia etching thiab tsis yog kev taw qhia etching. Kev taw qhia etching hais txogkev txiavnyob rau hauv ib qho kev taw qhia, thaum etching tsis yog-directional yog non-directional (Kuv yuam kev hais ntau dhau. Hauv luv luv, nws yog tshem tawm SiO2 hauv ib qho kev taw qhia los ntawm cov kua qaub thiab cov hauv paus tshwj xeeb). Hauv qhov piv txwv no, peb siv downward directional etching kom tshem tawm SiO2, thiab nws dhau los ua zoo li no.

Thaum kawg, tshem tawm cov photoresist. Lub sijhawm no, txoj kev tshem tawm cov photoresist tsis yog qhov ua kom los ntawm lub teeb irradiation uas tau hais los saum toj no, tab sis los ntawm lwm txoj kev, vim tias peb tsis tas yuav txhais qhov loj me tshwj xeeb rau lub sijhawm no, tab sis kom tshem tawm tag nrho cov photoresist. Thaum kawg, nws dhau los ua raws li qhia hauv daim duab hauv qab no.

Ua li no, peb tau ua tiav lub hom phiaj ntawm kev khaws cia qhov chaw tshwj xeeb ntawm Poly SiO2.

 

Kev tsim ntawm qhov chaw thiab ntws dej:

Thaum kawg, cia peb xav txog seb qhov chaw thiab qhov dej ntws tau tsim li cas. Txhua tus neeg tseem nco qab tias peb tau tham txog nws hauv qhov teeb meem kawg. Qhov chaw thiab qhov dej ntws yog ion-implanted nrog tib hom ntsiab lus. Lub sijhawm no, peb tuaj yeem siv photoresist los qhib qhov chaw / qhov dej ntws uas hom N xav tau cog. Txij li thaum peb tsuas yog coj NMOS ua piv txwv, txhua qhov hauv daim duab saum toj no yuav raug qhib, raws li qhia hauv daim duab hauv qab no.

Vim tias qhov uas tus photoresist npog tsis tuaj yeem cog rau hauv (lub teeb raug thaiv), N-hom ntsiab lus tsuas yog yuav raug cog rau ntawm NMOS uas xav tau. Vim tias lub substrate hauv qab poly raug thaiv los ntawm poly thiab SiO2, nws yuav tsis raug cog rau hauv, yog li nws dhau los ua zoo li no.

Nyob rau lub sijhawm no, ib qho qauv MOS yooj yim tau ua tiav. Hauv kev xav, yog tias qhov hluav taws xob ntxiv rau qhov chaw, ntws, poly thiab substrate, MOS no tuaj yeem ua haujlwm, tab sis peb tsis tuaj yeem tsuas yog siv lub probe thiab ntxiv qhov hluav taws xob ncaj qha rau qhov chaw thiab ntws. Lub sijhawm no, MOS wiring yog qhov xav tau, uas yog, ntawm MOS no, txuas cov xov hlau los txuas ntau MOS ua ke. Cia peb saib cov txheej txheem wiring.

 

Ua VIA:

Kauj ruam thawj zaug yog kom npog tag nrho MOS nrog ib txheej ntawm SiO2, raws li pom hauv daim duab hauv qab no:

Tau kawg, SiO2 no yog tsim los ntawm CVD, vim nws ceev heev thiab txuag lub sijhawm. Cov hauv qab no tseem yog cov txheej txheem ntawm kev tso photoresist thiab exposing. Tom qab qhov kawg, nws zoo li qhov no.

Tom qab ntawd siv txoj kev etching los etching ib lub qhov rau ntawm SiO2, raws li pom hauv qhov grey hauv daim duab hauv qab no. Qhov tob ntawm lub qhov no ncaj qha kov qhov chaw Si.

Thaum kawg, tshem tawm cov photoresist thiab tau txais cov tsos hauv qab no.

Lub sijhawm no, qhov yuav tsum tau ua yog sau tus neeg xyuas pib hauv qhov no. Raws li tus neeg xyuas pib no yog dab tsi? Txhua lub tuam txhab txawv, feem ntau ntawm lawv yog cov hlau tungsten, yog li yuav ua li cas sau qhov no? Txoj kev PVD (Physical Vapor Deposition) siv, thiab lub hauv paus ntsiab lus zoo ib yam li daim duab hauv qab no.

Siv cov hluav taws xob lossis cov ions muaj zog heev los tua cov khoom siv, thiab cov khoom siv tawg yuav poob rau hauv qab hauv daim ntawv ntawm cov atoms, yog li tsim cov txheej hauv qab. Cov khoom siv uas peb feem ntau pom hauv xov xwm hais txog cov khoom siv ntawm no.
Tom qab sau lub qhov, nws zoo li no.

Tau kawg, thaum peb sau nws, nws tsis yooj yim sua kom tswj tau qhov tuab ntawm cov txheej kom sib npaug rau qhov tob ntawm lub qhov, yog li yuav muaj qee qhov ntau dhau, yog li peb siv CMP (Chemical Mechanical Polishing) thev naus laus zis, uas suab zoo heev, tab sis nws yeej sib tsoo, sib tsoo cov khoom ntau dhau. Qhov tshwm sim yog zoo li no.

Txog rau lub sijhawm no, peb tau ua tiav qhov kev tsim cov txheej ntawm via. Tau kawg, qhov kev tsim cov via feem ntau yog rau kev txuas cov hlau txheej tom qab.

 

Kev tsim cov txheej hlau:

Nyob rau hauv cov xwm txheej saum toj no, peb siv PVD los tso lwm txheej hlau. Cov hlau no feem ntau yog cov hlau tooj liab.

Tom qab ntawd tom qab raug thiab etching, peb tau txais yam peb xav tau. Tom qab ntawd txuas ntxiv mus rau theem kom txog thaum peb ua tau raws li peb xav tau.

Thaum peb kos duab qhov layout, peb yuav qhia rau koj paub tias muaj pes tsawg txheej hlau thiab ntawm cov txheej txheem siv tau tuaj yeem muab sib dhos ua ke ntau tshaj plaws, uas txhais tau tias muaj pes tsawg txheej nws tuaj yeem muab sib dhos ua ke.
Thaum kawg, peb tau txais cov qauv no. Lub ncoo sab saum toj yog tus pin ntawm lub chip no, thiab tom qab ntim khoom, nws dhau los ua tus pin uas peb pom tau (ntawm chav kawm, kuv kos nws random, tsis muaj qhov tseem ceeb, tsuas yog piv txwv li).

Qhov no yog cov txheej txheem dav dav ntawm kev ua ib lub chip. Hauv qhov teeb meem no, peb tau kawm txog qhov tseem ceeb tshaj plaws ntawm kev raug, etching, ion implantation, furnace tubes, CVD, PVD, CMP, thiab lwm yam hauv semiconductor foundry.