SehlahisoaDtlhaloso
Sekepe sa Wafer sa Silicon carbide se sebelisoa haholo e le sets'oants'o sa wafer ts'ebetsong ea ho hasana ha mocheso o phahameng.
Melemo:
Khanyetso e phahameng ea mocheso:tšebeliso e tloaelehileng ho 1800 ℃
Ho khanna ha mocheso o phahameng:e lekanang le thepa ea graphite
Ho thatafala ho hoholo:boima bo latela taemane feela, boron nitride
Khanyetso ea ts'enyeho:asiti e matla le alkali ha li na mafome ho eona, khanyetso ea mafome e betere ho feta tungsten carbide le alumina
Boima bo bobebe:boima bo tlase, haufi le aluminium
Ha ho phetoho: coefficient e tlase ea katoloso ea mocheso
Khanyetso ea ho tšoha ha mocheso:e ka mamella liphetoho tse matla tsa mocheso, ea hanela ho thothomela ha mocheso, 'me e na le ts'ebetso e tsitsitseng
Matlotlo a 'Mele a SiC
| Thepa | Boleng | Mokhoa |
| Botenya | 3.21 g/cc | Sinki-float le boholo |
| Mocheso o itseng | 0.66 J/g °K | Leseli la laser le putlamang |
| Matla a ho tenyetseha | 450 MPa560 MPa | Kobeho ea lintlha tse 4, kobeho ea lintlha tse RT4, 1300° |
| Ho tiea ha ho robeha | 2.94 MPa m1/2 | Ho kobeha ha liphio tse nyenyane |
| Bothata | 2800 | Vicker's, mojaro oa 500g |
| Modulus ea Elastic ea Young | 450 GPa430 GPa | Kobeho ea 4 pt, kobeho ea RT4 pt, 1300 °C |
| Boholo ba lijo-thollo | 2 – 10 µm | SEM |
Thepa ea Thermal ea SiC
| Ho khanna ha mocheso | 250 W/m °K | Mokhoa oa ho bonesa ka laser, RT |
| Katoloso ea Thermal (CTE) | 4.5 x 10-6 °K | Mocheso oa kamore ho fihlela ho 950 °C, silica dilatometer |
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