ProductDescription
Silicon carbide Wafer Boat inoshandiswa zvakanyanya sechifukidzo chinobata mukupisa tembiricha yekuparadzira maitiro.
Zvakanakira:
High tembiricha kuramba:kushandiswa kwakajairika pa1800 ℃
High thermal conductivity:yakaenzana neye graphite zvinhu
High kuoma:kuoma kwechipiri chete kune diamond, boron nitride
Corrosion resistance:asidhi yakasimba uye alkali haina ngura kwairi, iyo corrosion resistance iri nani pane tungsten carbide uye alumina.
Chiremba uremu:low density, pedyo nealuminium
Hapana deformation: yakaderera coefficient yekuwedzera kwekupisa
Thermal shock resistance:inogona kumira kushanduka kwekushisa kwakapinza, kuramba kuvhunduka kwekushisa, uye ine kushanda kwakagadzikana
Zvenyama Zvimiro zveSiC
| Property | Value | Nzira |
| Density | 3.21 g/cc | Sink-float uye dimension |
| Kupisa chaiko | 0.66 J/g °K | Pulsed laser flash |
| Flexural simba | 450 MPa560 MPa | 4 point bend, RT4 point bend, 1300° |
| Kutsemuka kuomarara | 2.94 MPa m1/2 | Microindentation |
| Kuoma | 2800 | Vicker's, 500g mutoro |
| Elastic ModulusYoung's Modulus | 450 GPA430 GPA | 4 pt bend, RT4 pt bend, 1300 °C |
| Saizi yezviyo | 2 – 10 µm | SEM |
Thermal Properties yeSiC
| Thermal Conductivity | 250 W/m °K | Laser flash nzira, RT |
| Kuwedzera kweThermal (CTE) | 4.5 x 10-6 °K | Tembiricha yemumba kusvika 950 °C, silica dilatometer |
