Sei uchifanira kutetepa?

Muchikamu chekugadzirisa kumashure, iyochifukidziro (chifukidziro chesilicon(nemaseketi ari kumberi) anofanira kuchekwa kumashure asati achekwa, kusungirirwa uye kurongedza kuti aderedze kukwirira kwekuiswa kwepakeji, kuderedza vhoriyamu yepakeji yechip, kuvandudza kushanda kwekupisa kwechip, mashandiro emagetsi, hunhu hwemakanika uye kuderedza huwandu hwekuchekwa. Kukuya musana kune zvakanakira kushanda kwepamusoro uye mutengo wakaderera. Yakatsiva maitiro echinyakare ekucheka wet uye ion etching kuti ive tekinoroji inonyanya kukosha yekuchekwa musana.

Chingwa chakatetepa

Nzira yekuonda sei?

Maitiro makuru ekuderedza wafer muchirongwa chekare chekurongedza

Matanho chaiwo echifukidziroKutetepa kunofanira kubatanidza wafer kuti igadziriswe kufirimu rekutetepa, uye wozoshandisa vacuum kunamatira firimu rekutetepa nechipu iri pairi patafura yewafer ine maburi eceramic, kugadzirisa mitsetse yepakati pechikepe chemukati nekunze chebasa revhiri rekukuya rakaita sekapu kusvika pakati pewafer yesilicon, uye wafer yesilicon nevhiri rekukuya zvinotenderera zvakatenderedza matemo azvo kuti zvicheke. Kukwesha kunosanganisira matanho matatu: kukwesha zvisina kunaka, kukwesha zvakanaka uye kupukuta.

Wafer inobuda mufekitori yewafer inogayiwa kumashure kuti itetepese kusvika pakukora kunodiwa pakurongedza. Pakugaya wafer, tepi inofanira kuiswa kumberi (Active Area) kudzivirira nzvimbo yecircuit, uye divi rekumashure rinogayiwa panguva imwe chete. Mushure mekugaya, bvisa tepi uye yera ukobvu.
Maitiro ekukuya akabudirira pakugadzira silicon wafer anosanganisira kukuya tafura yakatenderera,chifukidziro chesiliconkukuya kutenderera, kukuya kwemativi maviri, nezvimwewo. Nekuvandudzwa kwakawedzerwa kwezvinodiwa zvemhando yepamusoro ye single crystal silicon wafers, matekinoroji matsva ekukuya anogara achikurudzirwa, akadai seTAIKO grinding, chemical mechanical grinding, polishing grinding uye planetary disc grinding.

Kukuya tafura yemuchina:

Kukuya tafura yekutenderera (kukuya tafura yekutenderera) inzira yekutanga yekukuya inoshandiswa mukugadzirira silicon wafer uye kuderedza musana. Nheyo yayo inoratidzwa muMufananidzo 1. Mawafer esilicon akaiswa pamakapu ekukweva etafura inotenderera, uye anotenderera achifambiswa netafura inotenderera. Mawafer esilicon pachawo haatenderere padivi pawo; vhiri rekukuya rinopihwa axially richitenderera nekumhanya kwakanyanya, uye dhayamita yevhiri rekukuya yakakura kupfuura dhayamita yewafer yesilicon. Kune mhando mbiri dzekukuya tafura yekutenderera: kukuya kumeso nekukuya kumeso. Mukukuya kumeso, upamhi hwevhiri rekukuya hwakakura kupfuura dhayamita yesilicon wafer, uye spindle yevhiri rekukuya inodya nguva dzose nenzira yayo ye axial kusvika yawedzerwa yagadziriswa, uye ipapo wafer yesilicon inotenderera pasi pedrive yetafura yekutenderera; mukukuya kumeso, vhiri rekukuya rinodya nenzira yayo ye axial, uye wafer yesilicon inotenderera nguva dzose pasi pedrive yediski inotenderera, uye kukuya kunopedzwa nekudyisa zvakare (reciprocation) kana creep feeding (creepfeed).

Mufananidzo 1, dhayagiramu yerotary table grinding (face tangential) principle

Zvichienzaniswa nenzira yekukuya, kukuya tafura inotenderera kune zvakanakira zvekubviswa kwakanyanya, kukuvara kudiki pamusoro, uye otomatiki nyore. Zvisinei, nzvimbo chaiyo yekukuya (active grinding) B uye angle yakachekwa θ (kona iri pakati pedenderedzwa rekunze revhiri rekukuya nedenderedzwa rekunze resilicon wafer) mukuita kwekukuya zvinoshanduka nekuchinja kwenzvimbo yekucheka vhiri rekukuya, zvichikonzera simba rekukuya risina kugadzikana, zvichiita kuti zviome kuwana kururama kwakakodzera kwepamusoro (TTV value yakakwira), uye zvichikonzera nyore nyore zvikanganiso zvakaita sekudonha kwemucheto nekudonha kwemucheto. Tekinoroji yekukuya tafura inotenderera inonyanya kushandiswa pakugadzirisa mawafer esilicon e-single-crystal ari pasi pe200mm. Kuwedzera kwehukuru hwemawafer esilicon e-single-crystal kwakaisa zvinodiwa zvepamusoro zvekururama kwepamusoro uye kururama kwekufamba kwebhenji rekushandira remidziyo, saka kukuya tafura inotenderera hakuna kukodzera kukuya mawafer esilicon e-single-crystal ari pamusoro pe300mm.
Kuti zvivandudze kushanda zvakanaka kwekukuya, michina yekukuya yemhando yepamusoro inowanzoshandisa chimiro chemavhiri akawanda ekukuya. Semuenzaniso, seti yemavhiri ekukuya akakora uye seti yemavhiri ekukuya akakora zvakashongedzwa pamidziyo, uye tafura inotenderera inotenderera denderedzwa rimwe kuti ipedzise kukuya kwakakora uye kukuya kwakakora zvichitevedzana. Rudzi urwu rwemidziyo runosanganisira G-500DS yeAmerican GTI Company (Mufananidzo 2).

Mufananidzo 2, Midziyo yekukuya tafura inotenderera yeG-500DS yeGTI Company muUnited States

Kukuya kwesilicon wafer kutenderera:

Kuti zvizadzise zvinodiwa zvekugadzirira silicon wafer yakakura uye kugadzirisa musana, uye kuwana kururama kwepamusoro neTTV yakanaka. Muna 1988, nyanzvi yekuJapan Matsui yakakurudzira nzira yekukuya silicon wafer (in-feedgrinding). Nheyo yayo inoratidzwa muMufananidzo 3. Wafer imwe chete ye crystal silicon uye dhaimani yekukuya yakaumbwa nekapu inonamirwa pabhenji rebasa zvinotenderera zvakatenderedza maaxes azvo, uye vhiri rekukuya rinogara richipihwa nenzira ye axial panguva imwe chete. Pakati pazvo, dhayamita yevhiri rekukuya yakakura kupfuura dhayamita yesilicon wafer yakagadziriswa, uye denderedzwa rayo rinopfuura nepakati pesilicon wafer. Kuti kuderedze simba rekukuya uye kuderedza kupisa kwekukuya, kapu yekukweva vacuum inowanzo gurwa kuita convex kana concave kana kona iri pakati pe grinding wheel spindle uye suction cup spindle axis inogadziriswa kuti ive nechokwadi chekukuya pakati pe grinding wheel ne silicon wafer.

Mufananidzo 3, Dhiyagiramu yemufananidzo wepfungwa yekukuya yesilicon wafer inotenderera

Zvichienzaniswa nekukuya tafura inotenderera, kukuya kwesilicon wafer kunotenderera kune zvakanakira zvinotevera: ① Kukuya kamwe chete kunogona kugadzirisa mawafer esilicon makuru anopfuura 300mm; ② Nzvimbo chaiyo yekukuya B nekona yekucheka θ hazvichinji, uye simba rekukuya rakagadzikana; ③ Nekugadzirisa kona yekutsvedza pakati pe axis yevhiri rekukuya ne axis yesilicon wafer, chimiro chepamusoro che single crystal silicon wafer chinogona kudzorwa kuti chive chakarurama zviri nani pamusoro. Pamusoro pezvo, nzvimbo yekukuya uye kona yekucheka θ ye silicon wafer inotenderera ine zvakanakirawo zvekukuya kukuru, nyore online ukobvu uye kuona kunaka kwenzvimbo, chimiro chemidziyo midiki, kukuya kuri nyore kwenzvimbo dzakawanda, uye kushanda zvakanaka kwekukuya.
Kuti ivandudze kushanda zvakanaka kwekugadzira uye igutse zvinodiwa nemitsetse yekugadzira semiconductor, michina yekukuya yekutengeserana yakavakirwa pamusimboti wekukuya kwesilicon wafer inoshandisa chimiro che multi-spindle multi-station, chinogona kupedzisa kukuya kwakakasharara uye kukuya kwakanaka mukutakura nekuburitsa zvinhu kamwe chete. Pamwe chete nedzimwe nzvimbo dzekubatsira, inogona kuita kukuya otomatiki kwe single crystal silicon wafers "dry-in/dry-out" uye "cassette to cassette".

Kukuya kwemativi maviri:

Kana silicon wafer ichigaya pamusoro nepazasi pesilicon wafer, workpiece inofanira kutenderedzwa yoitwa nematanho, izvo zvinoderedza kushanda zvakanaka. Panguva imwe chete, silicon wafer ichigaya ine zvikanganiso zvekukopa pamusoro (zvakakopwa) uye zvakanyorwa (zvinoratidza kugocha), uye hazvigoneke kubvisa zvinobudirira zvikanganiso zvakaita sekugona uye kutetepa pamusoro pe single crystal silicon wafer mushure mekucheka waya (multi-saw), sezvakaratidzwa muMufananidzo 4. Kuti zvikunde zvikanganiso zviri pamusoro apa, tekinoroji yekugaya ine mativi maviri (doublesidegrinding) yakaonekwa muma1990, uye musimboti wayo unoratidzwa muMufananidzo 5. Maclamp akapararira zvakaenzana kumativi ese ari maviri anosunga single crystal silicon wafer mu retaining ring uye anotenderera zvishoma nezvishoma achifambiswa neroller. Mavhiri maviri ekugaya edhaimani akaita sekapu ari pamativi ese e single crystal silicon wafer. Achifambiswa nemhepo ine spindle yemagetsi, anotenderera nenzira dzakasiyana uye anodya axially kuti awane double-sided grinding ye single crystal silicon wafer. Sezvatinoona kubva pamufananidzo, kukuya kwemativi maviri kunogona kubvisa kusviba uye kutetepa pamusoro pewafer imwe chete yekristalo silicon mushure mekucheka waya. Zvichienderana negwara rekuronga kwe grinding wheel axis, kukuya kwemativi maviri kunogona kunge kwakatwasuka uye kwakatwasuka. Pakati pazvo, kukuya kwemativi maviri kwakatwasuka kunogona kuderedza zvinobudirira simba rekushanduka kwewafer yesilicon kunokonzerwa nehuremu hwakafa hwewafer yesilicon pamhando yekukuya, uye zviri nyore kuve nechokwadi chekuti mamiriro ekukuya kumativi ese ewafer imwe chete yekristalo silicon akafanana, uye zvidimbu zvinogumbura uye machipisi ekukuya hazvisi nyore kugara pamusoro pewafer imwe chete yekristalo silicon. Inzira yakanaka yekukuya.

Mufananidzo 4, "Kopi yekukanganisa" uye zvikanganiso zvekuchekwa kwechiratidzo chekupwanyika pakukuya kwesilicon wafer kutenderera

Mufananidzo 5, dhayagiramu yemufananidzo wepfungwa yekukuya ine mativi maviri

Tafura 1 inoratidza kuenzanisa pakati pekukuya nekugaya mativi maviri kwemhando nhatu dziri pamusoro apa dze single crystal silicon wafers. Kukuya mativi maviri kunonyanya kushandiswa pakugadzira silicon wafer iri pasi pe200mm, uye kune goho rakakura rewafer. Nekuda kwekushandisa mavhiri ekukuya abrasive, kukuya kwe single-crystal silicon wafers kunogona kuwana hunhu hwepamusoro kupfuura hwekukuya mativi maviri. Naizvozvo, silicon wafer rotary grinding ne double-sided grinding zvinogona kusangana nezvinodiwa zvemhando yepamusoro ye 300mm silicon wafers, uye parizvino ndiyo nzira dzakakosha dzekugadzirisa flattening. Pakusarudza nzira yekugadzirisa flattening ye silicon wafer, zvakakosha kufunga zvakadzama nezvezvinodiwa zvehukuru hwedhayamita, hunhu hwepamusoro, uye tekinoroji yekugadzirisa wafer ye single-crystal silicon wafer. Kucheneswa kwewafer kumashure kunogona kungosarudza nzira yekugadzirisa mativi maviri, senge nzira ye silicon wafer rotary grinding.

Pamusoro pekusarudza nzira yekukuya mukugadzira silicon wafer, zvakakoshawo kusarudza maparamita ekugadzirisa akakodzera akadai sekumanikidzwa kwakanaka, saizi yegirasi yevhiri rekukuya, grinding wheel binder, grinding wheel speed, silicon wafer speed, grinding fluid viscosity uye flow rate, nezvimwewo, uye kuona nzira yekushanda inonzwisisika. Kazhinji, nzira yekukuya yakakamurwa inosanganisira rough grinding, semi-finishing grinding, finishing grinding, spark-free grinding uye slow backing inoshandiswa kuwana single crystal silicon wafers ine processing efficiency, high surface flat uye low surface damage.