Kwiminyaka yakutshanje, ukusetyenziswa kwezinto zeSiC kwishishini le-semiconductor kuye kwanda kancinci kancinci, ngakumbi kwizixhobo ze-elektroniki zamandla, izixhobo ze-optoelectronic kunye nezixhobo ezisebenzisa i-frequency ephezulu, apho ukusetyenziswa kwazo kuye kwanda kakhulu. I-SiC, enobunzima bayo obuphezulu kakhulu, uzinzo oluhle kakhulu lobushushu kunye neempawu ezilungileyo zombane, iye yaba yindlela ebalulekileyo yokutshintsha izinto ze-silicon (Si) kwishishini. Nangona kunjalo, ukuze kufezekiswe imveliso esebenzayo nesemgangathweni yezixhobo zeSiC, ukongeza ekubeni neemfuno ezingqongqo zenkqubo yokwenziwa kwee-wafer zeSiC, itekhnoloji yokuxhasa ii-wafer ayinakutyeshelwa nayo. Kule nkqubo, indima yeSiC Wafer Holder iba yinto ebaluleke kakhulu.
A Isibambi seSiC Wafersisixhobo esenzelwe ngokukodwa ukuxhasa nokulungisa ii-wafers zeSiC. Ii-wafers kufuneka zidlule kwiinkqubo ezininzi kwinkqubo yokuvelisa i-semiconductor, kubandakanya i-chemical vapor deposition (CVD), i-thin film deposition, i-photolithography, i-etching, njl. Zonke ezi nkqubo zifuna indawo echanekileyo kunye nenkxaso ezinzileyo yee-wafers. I-SiC Wafer Holder yenzelwe ngokuchanekileyo ukubonelela ngenkxaso ezinzileyo, ukuqinisekisa ukuba ii-wafers aziguquki, azigobi okanye aziguquki ngexesha lezi nkqubo. Ngenxa yobunzima obuphezulu kakhulu kunye nokumelana nobushushu obuphezulu bezinto zeSiC, ii-SiC Wafer holders zihlala zenziwe ngezinto ezinokumelana nobushushu obuphezulu kunye nokugqwala, kwaye kufuneka zibe ne-thermal conductivity elungileyo kunye nozinzo lweekhemikhali.
Kwinkqubo yokwenziwa kwee-semiconductor, ii-wafer ze-SiC zihlala zifuna ukucutshungulwa kwindawo enobushushu obuphezulu kunye noxinzelelo oluphezulu. Phantsi kwezi meko zenkqubo, ii-wafers zichaphazeleka kakhulu ziimpembelelo zomzimba zangaphandle, ukwanda kobushushu kunye nezinye izinto, ezikhokelela ekuguqukeni, ekukrweleni okanye ekungcoleni kwee-wafers. Indima yeSiC Wafer Holder kukuthintela ngqo ezi ngxaki ukuba zenzeke ngokubonelela ngamandla enkxaso aqinileyo nazinzileyo.
Isicelo
- I-CVD (Ukususwa koMphunga weKhemikhali): Kwinkqubo ye-CVD, inokubonelela ngenkxaso echanekileyo yokubeka i-wafer, iqinisekisa ukufakwa okufanayo kwefilimu emoyeni
- I-Lithography kunye ne-Etching: Inokuqinisekisa ukulungelelaniswa ngokuchanekileyo kwe-wafer, iphephe iipateni ze-offset kunye ne-asymmetrical, kwaye iqinisekise ukuchaneka kwesiphumo se-etching
- I-PVD: Kwiinkqubo ezifana ne-PVD kunye nokutshiza, kuyimfuneko ukubonelela ngenkxaso elungileyo kwaye ukwazi ukumelana nempembelelo yamasuntswana anamandla aphezulu ukuze kugcinwe ukusebenza okuzinzileyo.
- Uvavanyo kunye nokuPakisha: Ngexesha lovavanyo kunye nokupakishwa kwezixhobo ze-semiconductor, ingakumbi kuvavanyo lwezixhobo ezisebenzisa amaza aphezulu kunye nezixhobo ezinamandla aphezulu, kufuneka inkqubo yenkxaso echanekileyo kakhulu.
Ixesha lokuthumela: Agasti-08-2025