Theknoloji ea Photolithography e shebane haholo le ho sebelisa litsamaiso tsa mahlo ho pepesa mekhoa ea potoloho holim'a li-wafer tsa silicon. Ho nepahala ha ts'ebetso ena ho ama ka kotloloho ts'ebetso le tlhahiso ea lipotoloho tse kopantsoeng. E le e 'ngoe ea lisebelisoa tse holimo tsa tlhahiso ea li-chip, mochini oa lithography o na le likarolo tse fihlang ho makholo a likete. Likarolo tsa mahlo le likarolo tse ka har'a sistimi ea lithography li hloka ho nepahala ho hoholo ho netefatsa ts'ebetso ea potoloho le ho nepahala.Liserame tsa SiCli sebelisitsoe holi-chucks tsa waferle liipone tse sekwere tsa letsopa.
Wafer chuckSekotwana sa wafer ka mochining oa lithography se jara le ho tsamaisa wafer nakong ea ts'ebetso ea ho pepesehela. Ho hokahanya ka nepo pakeng tsa wafer le chuck ho bohlokoa bakeng sa ho etsisa mohlala o holim'a wafer ka nepo.SiC waferLi-chuck li tsebahala ka botsitso ba tsona bo bobebe, bo nang le tekanyo e phahameng le coefficient e tlase ea katoloso ea mocheso, e ka fokotsang meroalo e sa sebetseng le ho ntlafatsa katleho ea motsamao, ho nepahala ha sebaka le botsitso.
Seipone sa sekwere sa letsopa Mochining wa lithography, ho hokahanya motsamao pakeng tsa wafer chuck le sethala sa maske ho bohlokoa, e leng se amang ka ho toba ho nepahala le tlhahiso ea lithography. Seipone sa sekwere ke karolo ea bohlokoa ea sistimi ea ho lekanya maikutlo a ho hlahloba sebaka sa wafer chuck, 'me litlhoko tsa eona tsa thepa li bobebe ebile li tiile. Le hoja li-ceramic tsa silicon carbide li na le thepa e ntle ea bobebe, ho hlahisa likarolo tse joalo ho thata. Hona joale, bahlahisi ba etellang pele ba lisebelisoa tsa potoloho tse kopaneng tsa machaba ba sebelisa haholo-holo lisebelisoa tse kang silica e kopantsoeng le cordierite. Leha ho le joalo, ka tsoelo-pele ea theknoloji, litsebi tsa Chaena li fihletse tlhahiso ea liipone tsa sekwere tsa silicon carbide tsa ceramic tse kholo, tse bōpehileng joaloka tse rarahaneng, tse bobebe haholo, tse koetsoeng ka botlalo le likarolo tse ling tse sebetsang tsa optical bakeng sa mechini ea photolithography. Photomask, e tsejoang hape e le lesoba, e fetisa leseli ka maske ho etsa mohlala holim'a thepa e utloang khanya. Leha ho le joalo, ha leseli la EUV le bonesa maske, le ntša mocheso, le phahamisa mocheso ho fihlela ho likhato tse 600 ho isa ho tse 1000 tsa Celsius, e leng se ka bakang tšenyo ea mocheso. Ka hona, lera la filimi ea SiC hangata le beoa holim'a photomask. Likhamphani tse ngata tsa kantle ho naha, tse kang ASML, joale li fana ka lifilimi tse nang le phetiso ea ho feta 90% ho fokotsa ho hloekisa le ho hlahloba nakong ea ts'ebeliso ea maske ea photomask le ho ntlafatsa katleho le tlhahiso ea lihlahisoa tsa mechini ea photolithography ea EUV.
Ho Sebetsa ka Lero la Malile Deposition Photomasks, tse tsejoang hape e le crosshairs, li na le mosebetsi o ka sehloohong oa ho fetisa leseli ka maske le ho etsa paterone holim'a thepa e utloang khanya. Leha ho le joalo, ha leseli la EUV (extreme ultraviolet) le bonesa photomask, le ntša mocheso, le phahamisa mocheso ho ea pakeng tsa likhato tse 600 le 1000 tsa Celsius, e leng se ka bakang tšenyo ea mocheso. Ka hona, lera la filimi ea silicon carbide (SiC) hangata le beoa holim'a photomask ho fokotsa bothata bona. Hona joale, lik'hamphani tse ngata tsa kantle ho naha, tse kang ASML, li qalile ho fa lifilimi pepeneneng ea ho feta 90% ho fokotsa tlhoko ea ho hloekisa le ho hlahloba nakong ea ts'ebeliso ea photomask, ka hona ho ntlafatsa katleho le tlhahiso ea sehlahisoa sa mechini ea lithography ea EUV. Plasma Etching leLesale la ho Tsepamisa Ponahalole ba bang Tlhahisong ea li-semiconductor, ts'ebetso ea ho hlaba e sebelisa lintho tse ntšang metsi kapa khase (tse kang likhase tse nang le fluorine) tse entsoeng ka ion ho plasma ho hlasela wafer le ho tlosa lintho tse sa batleheng ka khetho ho fihlela mokhoa o lakatsehang oa potoloho o lula holim'asejana sa bohobebokaholimo. Ka lehlakoreng le leng, ho beoa ha filimi e tšesaane ho tšoana le lehlakore le ka morao la ho beoa, ho sebelisoa mokhoa oa ho beoa ho bokella thepa e sireletsang mocheso lipakeng tsa mealo ea tšepe ho etsa filimi e tšesaane. Kaha lits'ebetso tsena ka bobeli li sebelisa theknoloji ea plasma, li na le litlamorao tse senyang likamoreng le likarolong. Ka hona, likarolo tse ka hare ho lisebelisoa li hlokahala hore li be le khanyetso e ntle ea plasma, karabelo e tlase ho likhase tse beoang tsa fluorine, le conductivity e tlase. Likarolo tsa lisebelisoa tsa setso tsa ho beoa le ho beoa, joalo ka mehele ea ho tsepamisa maikutlo, hangata li entsoe ka thepa e kang silicon kapa quartz. Leha ho le joalo, ka tsoelo-pele ea miniaturization ea potoloho e kopaneng, tlhoko le bohlokoa ba lits'ebetso tsa ho beoa tlhahisong ea potoloho e kopaneng lia eketseha. Boemong ba microscopic, ho beoa ha silicon wafer e nepahetseng ho hloka plasma e nang le matla a mangata ho fihlela bophara ba mela e menyenyane le meaho e rarahaneng ea lisebelisoa. Ka hona, ho beoa ha chemical vapor deposition (CVD) silicon carbide (SiC) butle-butle e fetohile thepa e ratoang ea ho beoa bakeng sa lisebelisoa tsa ho beoa le ho beoa ka thepa ea eona e ntle ea 'mele le ea lik'hemik'hale, bohloeki bo phahameng le ho tšoana. Hona joale, likarolo tsa CVD silicon carbide lisebelisoa tsa ho beoa li kenyelletsa mehele ea ho tsepamisa maikutlo, lihlooho tsa shaoara ea khase, literei le mehele ea bohale. Lisebelisoang tsa ho beha lintho fatše, ho na le likoahelo tsa likamore, li-liner tsa likamore leLi-substrate tsa graphite tse koahetsoeng ka SIC.
Ka lebaka la ho se sebetse hantle ha eona le ho tsamaisa ha eona likhase tse hlabang tsa chlorine le fluorine,Carbide ea silicon ea CVDe se e le thepa e loketseng bakeng sa likarolo tse kang masale a ho tsepamisa maikutlo lisebelisoa tsa ho fata plasma.Carbide ea silicon ea CVDLikarolo tse ka har'a lisebelisoa tsa ho betla li kenyelletsa masale a shebaneng, lihlooho tsa shaoara ea khase, literei, masale a bohale, jj. Nka masale a shebaneng le 'ona e le mohlala, ke likarolo tsa bohlokoa tse behiloeng ka ntle ho wafer 'me li kopana ka ho toba le wafer. Ka ho sebelisa motlakase lesale, plasma e lebisitsoe ka lesale ho ea ho wafer, e leng se ntlafatsang ho tšoana ha ts'ebetso. Ka setso, masale a shebaneng le 'ona a entsoe ka silicon kapa quartz. Leha ho le joalo, ha miniaturization ea potoloho e kopaneng e ntse e tsoela pele, tlhoko le bohlokoa ba lits'ebetso tsa ho betla tlhahisong ea potoloho e kopaneng li ntse li eketseha. Matla a ho betla ka plasma le litlhoko tsa matla li ntse li eketseha, haholo-holo lisebelisoa tsa ho betla ka plasma (CCP) tse kopantsoeng ka capacitively, tse hlokang matla a phahameng a plasma. Ka lebaka leo, tšebeliso ea masale a shebaneng le 'ona a entsoeng ka thepa ea silicon carbide e ntse e eketseha.
Nako ea poso: Mphalane-29-2024