Nā pahuhopu sputtering i hoʻohana ʻia i nā kaapuni hoʻohui semiconductor

Nā pahuhopu hoʻoheheʻehoʻohana nui ʻia i nā ʻoihana uila a me ka ʻike, e like me nā kaapuni i hoʻohui ʻia, ka mālama ʻike, nā hōʻikeʻike kristal wai, nā hoʻomanaʻo laser, nā mea hoʻokele uila, a pēlā aku. Hiki ke hoʻohana ʻia iā lākou ma ke kahua o ka uhi ʻana i ke aniani, a me nā mea pale ʻaʻahu, ke kūpaʻa ʻana i ka palaho wela kiʻekiʻe, nā huahana hoʻonaninani kiʻekiʻe a me nā ʻoihana ʻē aʻe.

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ʻO ka sputtering kekahi o nā ʻano hana nui no ka hoʻomākaukau ʻana i nā mea ʻili lahilahi.Hoʻohana ia i nā ion i hana ʻia e nā kumu ion e hoʻolalelale a hōʻuluʻulu i loko o kahi hakahaka e hana i nā kukuna ion ikehu wikiwiki, hoʻouka i ka ʻili paʻa, a hoʻololi i ka ikehu kinetic ma waena o nā ion a me nā ʻātoma o ka ʻili paʻa. Haʻalele nā ​​​​ʻātoma ma ka ʻili paʻa i ka mea paʻa a waiho ʻia ma luna o ka ʻili o ka substrate. ʻO ka mea paʻa i hoʻouka ʻia ka mea maka no ka waiho ʻana i nā kiʻiʻoniʻoni lahilahi ma o ka sputtering, i kapa ʻia ʻo sputtering target. Ua hoʻohana nui ʻia nā ʻano mea kiʻiʻoniʻoni lahilahi sputtered i nā kaapuni hoʻohui semiconductor, nā pāpaho hoʻopaʻa leo, nā hōʻikeʻike panela pālahalaha a me nā uhi ʻili workpiece.

Ma waena o nā ʻoihana noi āpau, ʻo ka ʻoihana semiconductor ka mea i loaʻa nā koi maikaʻi koʻikoʻi loa no nā kiʻiʻoniʻoni sputtering target. Hoʻohana nui ʻia nā pahuhopu sputtering metala kiʻekiʻe i ka hana wafer a me nā kaʻina hana hoʻopili holomua. Ma ka lawe ʻana i ka hana chip ma ke ʻano he laʻana, hiki iā mākou ke ʻike mai kahi wafer silicon a i kahi chip, pono ia e hele ma o 7 mau kaʻina hana nui, ʻo ia hoʻi ka diffusion (Thermal Process), Photo-lithography (Photo-lithography), Etch (Etch), Ion Implantation (IonImplant), Thin Film Growth (Dielectric Deposition), Chemical Mechanical Polishing (CMP), Metalization (Metalization) Pili nā kaʻina hana i kēlā me kēia. Hoʻohana ʻia ka pahuhopu sputtering i ke kaʻina hana o ka "metallization". Hoʻopuehu ʻia ka pahuhopu me nā ʻāpana ikehu kiʻekiʻe e nā lako hana waiho ʻili lahilahi a laila hoʻokumu ʻia kahi papa metala me nā hana kikoʻī ma ka wafer silicon, e like me ka papa conductive, ka papa barrier. E kali. ʻOiai ua ʻokoʻa nā kaʻina hana o nā semiconductors holoʻokoʻa a laila pono kekahi mau kūlana i kekahi manawa no ka hōʻoia ʻana ua ola pono ka ʻōnaehana no laila ke koi nei mākou i kekahi mau ʻano mea dummy ma kekahi mau pae o ka hana e hōʻoia i nā hopena.


Ka manawa hoʻouna: Ian-17-2022
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