Fa'amoemoega fa'aosoe masani ona faʻaaogaina i pisinisi faʻaeletoronika ma faʻamatalaga, e pei o matagaluega tuʻufaʻatasi, teuina o faʻamatalaga, faʻaaliga tioata vai, manatua laser, masini faʻatonutonu eletise, ma isi. E mafai foi ona faʻaaogaina i le matata o le ufiufi tioata, faʻapea foi i mea e teteʻe i le ofuina, teteʻe atu i le ele i le vevela maualuga, oloa teuteu maualuga ma isi pisinisi.
O le sputtering o se tasi o metotia autū mo le sauniaina o mea e fai i ata manifinifi.E faʻaaogaina ai ions e gaosia e punaoa ion e faʻavavevave ma faʻaputu i totonu o se masini e fausia ai ni ave ion e saoasaoa tele, faʻapaʻia le fogāeleele malo, ma fesuiaʻi le malosi faʻatino i le va o ions ma atomu o le fogāeleele malo. O atomu i luga o le fogāeleele malo e tuʻua le malo ma faʻaputu i luga o le fogāeleele o le substrate. O le malo ua faʻapaʻiaina o le mea mata lea mo le faʻaputuina o ata manifinifi e ala i le sputtering, lea e taʻua o le sputtering target. O ituaiga eseese o mea ata manifinifi ua faʻaaogaina lautele i semiconductor integrated circuits, media recording, flat-panel displays ma workpiece surface coatings.
I totonu o pisinisi uma o loʻo faʻaaogaina, o le pisinisi semiconductor e sili ona manaʻomia le tulaga lelei mo ata tifaga sputtering. O target sputtering uʻamea mama maualuga e faʻaaogaina tele i le gaosiga o wafer ma faiga faʻapipiʻi faʻapitoa. I le faʻaaogaina o le gaosiga o chips o se faʻataʻitaʻiga, e mafai ona tatou vaʻaia mai se silicon wafer i se chip, e manaʻomia ona ui atu i faiga tetele e 7 o le gaosiga, e pei o le diffusion (Thermal Process), Photo-lithography (Photo-lithography), Etch (Etch), Ion Implantation (IonImplant), Thin Film Growth (Dielectric Deposition), Chemical Mechanical Polishing (CMP), Metalization (Metalization). E fetaui lelei faiga taʻitasi. O le target sputtering e faʻaaogaina i le faiga o le "metallization". E faʻapipiʻiina le target i ni vaega malolosi e ala i masini e faʻapipiʻi ai ata tifaga manifinifi ona faia lea o se vaega uʻamea e iai galuega faʻapitoa i luga o le silicon wafer, e pei o le conductive layer, barrier layer. Faatali. Talu ai ona eseese faiga o semiconductors uma, o lea e manaʻomia ai nisi tulaga mo le faʻamaoniaina o loʻo iai saʻo le faiga o lea matou te manaʻomia ai ni ituaiga o mea taufaʻaseʻe i nisi o laʻasaga o le gaosiga e faʻamaonia ai aafiaga.
Taimi na lafoina ai: Ianuari-17-2022