Integozikoreshwa cyane cyane mubyuma bya elegitoroniki ninganda zamakuru, nkumuzunguruko uhuriweho, kubika amakuru, kwerekana amazi ya kirisiti yerekana, kwibuka lazeri, ibikoresho byo kugenzura ibikoresho bya elegitoroniki, nibindi.
Gusohora ni bumwe mu buryo bwingenzi bwo gutegura ibikoresho bya firime.Ikoresha ion ikomoka kumasoko ya ion kugirango yihute kandi ikusanyirize mu cyuho kugirango ikore ibiti byihuta byingufu za ion, itera ibisasu hejuru, kandi ihana ingufu za kinetic hagati ya ion na atome zikomeye. Atome hejuru yubutaka isiga ikomeye kandi igashyirwa hejuru yubutaka. Igisasu cyatewe hejuru ni ibikoresho fatizo byo kubitsa firime zoroheje ukoresheje sputtering, ibyo bita sputtering target. Ubwoko butandukanye bwibikoresho bya firime byoroheje byakoreshejwe cyane mumashanyarazi ya semiconductor ihuriweho hamwe, gufata amajwi, ibipapuro byerekana neza hamwe nubutaka bwakorewe.
Mu nganda zose zikoreshwa, inganda za semiconductor zifite ibyangombwa bisabwa byujuje ubuziranenge kuri firime zigenda zisohoka. Dufashe urugero rwo gukora chip, dushobora kubona ko kuva kuri silicon wafer kugeza kuri chip, bigomba kunyura mubikorwa 7 byingenzi byakozwe, aribyo gukwirakwiza (Thermal Process), Photo-lithography (Photo-lithography), Etch (Etch), Ion Implantation (IonImplant), Thin Film Growth (Dielectric Mechanical Metalisation) umwe umwe. Intego ya sputtering ikoreshwa mugikorwa cya "metallisation". Intego yibasiwe nuduce twinshi twingufu zikoreshwa mubikoresho byoherejwe na firime hanyuma noneho icyuma gifite imikorere yihariye gikozwe kuri wafer ya silicon, nk'urwego ruyobora, urwego rwa bariyeri. Tegereza.Kubera ko inzira za semiconductor zose ziratandukanye noneho ibihe bimwe na bimwe birakenewe kugirango tumenye neza ko sisitemu ibaho neza bityo turasaba ubwoko bwibikoresho bya dummy mubyiciro bimwe na bimwe byakozwe kugirango twemeze ingaruka.
Igihe cyo kohereza: Mutarama-17-2022