Ana amfani da maƙasudin sputtering a cikin da'irori masu haɗa semiconductor

Manufofin da ke haifar da ɓarnaAna amfani da su galibi a masana'antar lantarki da bayanai, kamar da'irori masu haɗawa, ajiyar bayanai, nunin lu'ulu'u na ruwa, tunanin laser, na'urorin sarrafa lantarki, da sauransu. Hakanan ana iya amfani da su a fannin rufe gilashi, da kuma a cikin kayan da ba sa jure lalacewa, juriya ga tsatsa mai zafi, samfuran ado masu inganci da sauran masana'antu.

Tsarkakakken Tsarkakakke 99.995% Titanium Sputtering TargetManufa ta Ferrum SputteringTarget ɗin Carbon C, Graphite Target

Sputtering yana ɗaya daga cikin manyan dabarun shirya kayan fim na siriri.Yana amfani da ions da tushen ion ke samarwa don hanzartawa da taruwa a cikin injin don samar da hasken ion mai ƙarfi mai sauri, jefa saman daskararru, da musayar kuzarin motsi tsakanin ions da ƙwayoyin halitta masu ƙarfi. Kwayoyin halitta da ke kan saman daskararru suna barin daskararru kuma ana ajiye su a saman substrate. Daskararru mai fashewa shine kayan da ake amfani da su don sanya siraran fina-finai ta hanyar sputtering, wanda ake kira sputtering manufa. An yi amfani da nau'ikan kayan fim masu siriri iri-iri a cikin da'irori masu haɗa semiconductor, kafofin watsa labarai na rikodi, nunin faifai mai faɗi da kuma rufin saman aiki.

Daga cikin dukkan masana'antun aikace-aikace, masana'antar semiconductor tana da mafi tsaurin buƙatun inganci don fina-finan sputtering masu manufa. Ana amfani da maƙasudin sputtering na ƙarfe mai tsabta a cikin kera wafer da hanyoyin marufi na ci gaba. Idan muka ɗauki misali na kera guntu, za mu iya ganin cewa daga silicon wafer zuwa guntu, yana buƙatar wucewa ta manyan hanyoyin samarwa guda 7, wato yaɗuwa (Tsarin Zafi), Photo-lithography (Photo-lithography), Etch (Etch), Ion dasawa (Ion Implant), Thin Film Growth (Dielectric Deposition), Chemical Mechanical Polishing (CMP), Metalization (Metalization) Tsarin yana daidai da ɗaya bayan ɗaya. Ana amfani da maƙasudin sputtering a cikin tsarin "metallization". Ana jefar da maƙasudin da barbashi masu ƙarfi ta hanyar kayan aikin adana fim na siriri sannan a samar da wani Layer na ƙarfe mai takamaiman ayyuka akan silicon wafer, kamar layin conductive, Layer shinge. Jira. Tunda hanyoyin dukkan semiconductors sun bambanta, to akwai wasu yanayi na lokaci-lokaci da ake buƙata don tabbatar da cewa tsarin ya wanzu daidai, don haka muna buƙatar wasu nau'ikan kayan da ba a san su ba a wasu matakai na samarwa don tabbatar da tasirin.


Lokacin Saƙo: Janairu-17-2022
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