Ama-targets akhipha amanziZisetshenziswa kakhulu embonini ye-elekthronikhi kanye nolwazi, njengezifunda ezihlanganisiwe, isitoreji solwazi, izibonisi zekristalu eliwuketshezi, izinkumbulo ze-laser, amadivayisi okulawula kagesi, njll. Zingasetshenziswa futhi emkhakheni wokumboza ingilazi, kanye nasezintweni ezingagugi, ukumelana nokugqwala okushisa okuphezulu, imikhiqizo yokuhlobisa ephezulu kanye neminye imboni.
Ukutshiza kungenye yezindlela eziyinhloko zokulungiselela izinto ezincane zefilimu.Isebenzisa ama-ion akhiqizwa yimithombo yama-ion ukusheshisa nokuhlangana endaweni evalekile ukuze yakhe imisebe yama-ion yamandla asheshayo, ihlasele ubuso obuqinile, futhi ishintshe amandla e-kinetic phakathi kwama-ion nama-athomu angaphezulu aqinile. Ama-athomu aphezu kobuso obuqinile ayashiya okuqinile bese ebekwa ebusweni be-substrate. I-bombarded solid iyizinto zokusetshenziswa zokufaka amafilimu amancane ngokufaka ama-sputtering, okubizwa ngokuthi i-sputtering target. Izinhlobo ezahlukene zezinto zefilimu encane efakwe ama-sputtered ziye zasetshenziswa kabanzi kumasekethe ahlanganisiwe e-semiconductor, imidiya yokuqopha, izibonisi zephaneli ezisicaba kanye nezingubo zokugqoka zobuso be-workpiece.
Phakathi kwazo zonke izimboni zokufaka isicelo, imboni ye-semiconductor inezidingo zekhwalithi eziqinile kakhulu zamafilimu okubhoboza okuqondiwe. Ama-targets okubhoboza okunensimbi ahlanzekile kakhulu asetshenziswa kakhulu ekukhiqizeni i-wafer kanye nezinqubo zokupakisha ezithuthukisiwe. Uma sibheka ukukhiqizwa kwe-chip njengesibonelo, singabona ukuthi kusukela ku-wafer ye-silicon kuya ku-chip, idinga ukudlula ezinqubweni zokukhiqiza ezi-7 ezinkulu, okungukuthi ukusabalala (Inqubo Yokushisa), i-Photo-lithography (I-Photo-lithography), i-Etch (Etch), i-Ion Implantation (IonImplant), i-Thin Film Growth (Dielectric Deposition), i-Chemical Mechanical Polishing (CMP), i-Metalization (Metalization). Izinqubo zihambisana ngayinye ngayinye. I-target yokubhoboza isetshenziswa enqubweni "yokwenza insimbi". I-target ihlaselwa ngezinhlayiya zamandla aphezulu ngemishini yokubeka ifilimu encane bese kwakheka ungqimba lwensimbi olunemisebenzi ethile ku-wafer ye-silicon, njengengqimba yokuhambisa, ungqimba lwesithiyo. Linda. Njengoba izinqubo ze-semiconductors zonke ziyahlukahluka, kudingeka izimo ezithile ngezikhathi ezithile ukuqinisekisa ukuthi uhlelo lukhona kahle ngakho-ke sidinga izinhlobo ezithile zezinto zobuqili ezigabeni ezithile zokukhiqiza ukuqinisekisa imiphumela.
Isikhathi sokuthunyelwe: Jan-17-2022