Bartilmaameedyada xoqitaankaWaxaa badanaa loo isticmaalaa warshadaha elektaroonigga iyo macluumaadka, sida wareegyada isku dhafan, kaydinta macluumaadka, bandhigyada kiristaalka dareeraha ah, xusuusta laysarka, aaladaha xakamaynta elektaroonigga ah, iwm. Waxa kale oo loo isticmaali karaa dahaarka galaaska, iyo sidoo kale agabka u adkaysta xirashada, iska caabbinta daxalka heerkulka sare, alaabada qurxinta ee heerka sare ah iyo warshadaha kale.
Sputtering waa mid ka mid ah farsamooyinka ugu muhiimsan ee loo diyaariyo agabka filimada khafiifka ah.Waxay isticmaashaa ayoonnada ay soo saaraan ilaha ayoonnada si ay u dardar geliyaan oo ay isugu geeyaan faakuumka si ay u sameeyaan fallaadhaha ayoonnada tamarta xawaaraha sare leh, u duqeeyaan dusha adag, oo ay u beddelaan tamarta dhaqdhaqaaqa ee u dhaxaysa ayoonnada iyo atamka dusha adag. Atamyada dusha adag ku yaal waxay ka tagaan adag waxayna ku shubmaan dusha sare ee substrate-ka. Adkaha la duqeeyay waa walxaha ceeriin ah ee lagu shubo filimada khafiifka ah iyadoo la isticmaalayo sputtering, kaas oo loo yaqaan sputtering target. Noocyo kala duwan oo ah agabyada filimka khafiifka ah ee sputtered ayaa si weyn loogu isticmaalay wareegyada isku dhafan ee semiconductor, warbaahinta duubista, bandhigyada guddiyada fidsan iyo dahaarka dusha sare ee shaqada.
Dhammaan warshadaha codsiyada, warshadaha semiconductor-ka waxay leeyihiin shuruudaha tayada ugu adag ee filimada sputtering bartilmaameedka. Bartilmaameedyada sputtering biraha ee saafiga ah waxaa inta badan loo isticmaalaa soo saarista wafer iyo hababka baakadaha ee horumarsan. Tusaale ahaan, marka la soo saaro chip-ka, waxaan arki karnaa in laga bilaabo wafer silicon ilaa chip, ay u baahan tahay inay marto 7 hab oo wax soo saar oo waaweyn, kuwaas oo kala ah faafinta (Hawsha Kulaylka), Photo-lithography (Photo-lithography), Etch (Etch), Ion Implantation (Ion Implant), Caato Film Growth (Dielectric Deposition), Chemical Mechanical Polishing (CMP), Metalization (Metalization) Hawsha waxay mid mid u dhigantaa. Bartilmaameedka sputtering waxaa loo isticmaalaa habka "metalization". Bartilmaameedka waxaa lagu duqeeyaa walxo tamar sare leh qalabka dhigista filim khafiif ah ka dibna lakab bir ah oo leh hawlo gaar ah ayaa laga sameeyaa wafer silicon, sida lakabka gudbiyaha, lakabka xannibaadda. Sug. Maadaama hababka semiconductors-ka oo dhan ay kala duwan yihiin, xaalado marmar ah ayaa loo baahan yahay si loo xaqiijiyo in nidaamku si sax ah u jiray, markaa waxaan u baahannahay noocyo ka mid ah walxaha been abuurka ah marxaladaha qaarkood ee wax soo saarka si loo xaqiijiyo saameynta.
Waqtiga boostada: Jan-17-2022


