Zolinga zopukutira zomwe zimagwiritsidwa ntchito m'mabwalo ophatikizika a semiconductor

Zolinga zotulutsa madziAmagwiritsidwa ntchito makamaka m'mafakitale a zamagetsi ndi zidziwitso, monga ma circuits ophatikizidwa, kusungira chidziwitso, zowonetsera zamakristalo amadzimadzi, zokumbukira za laser, zida zamagetsi zowongolera, ndi zina zotero. Angagwiritsidwenso ntchito pakupanga magalasi, komanso pazinthu zosatha, kukana dzimbiri kutentha kwambiri, zinthu zokongoletsera zapamwamba komanso mafakitale ena.

High Oyera 99.995% Titanium Sputtering ChandamaleCholinga cha Ferrum SputteringCholinga cha Kupopera kwa Carbon C, Cholinga cha Graphite

Kuthira madzi ndi njira imodzi yofunika kwambiri yokonzekera zinthu zopyapyala.Imagwiritsa ntchito ma ayoni opangidwa ndi magwero a ayoni kuti ifulumizitse ndikuphatikizana mu vacuum kuti ipange ma ion beams amphamvu othamanga kwambiri, iphulike pamwamba pa solid, ndikusinthanitsa mphamvu ya kinetic pakati pa ma ayoni ndi ma atomu a solid surface. Ma atomu omwe ali pamwamba pa solid amachoka pa solid ndipo amaikidwa pamwamba pa substrate. Bombarded solid ndi zinthu zopangira kuyika mafilimu opyapyala pogwiritsa ntchito sputtering, yomwe imatchedwa sputtering target. Mitundu yosiyanasiyana ya zipangizo zopyapyala zopyapyala zakhala zikugwiritsidwa ntchito kwambiri mu semiconductor integrated circuits, recording media, flat-panel displays ndi workpiece surface coatings.

Pakati pa mafakitale onse ogwiritsira ntchito, makampani opanga ma semiconductor ali ndi zofunikira kwambiri pa khalidwe la mafilimu otulutsa ma target. Ma target otulutsa ma sputter achitsulo oyeretsedwa kwambiri amagwiritsidwa ntchito kwambiri popanga ma wafer ndi njira zapamwamba zopakira. Mwachitsanzo, potengera kupanga ma chip, titha kuwona kuti kuchokera ku silicon wafer kupita ku chip, imafunika kudutsa njira zazikulu 7 zopangira, zomwe ndi kufalikira (Thermal Process), Photo-lithography (Photo-lithography), Etch (Etch), Ion Implantation (IonImplant), Thin Film Growth (Dielectric Deposition), Chemical Mechanical Polishing (CMP), Metalization (Metalization). Njirazi zimagwirizana chimodzi ndi chimodzi. Cholinga chotulutsa ma sputter chimagwiritsidwa ntchito mu "metallization". Cholingacho chimadzazidwa ndi tinthu tamphamvu kwambiri ndi zida zopyapyala zoyika filimu kenako chitsulo chokhala ndi ntchito zinazake chimapangidwa pa silicon wafer, monga conductive layer, barrier layer. Yembekezerani. Popeza njira za ma semiconductors onse zimasiyana, nthawi zina pamafunika zochitika zina kuti zitsimikizire kuti dongosololi lili bwino kotero timafuna mitundu ina ya zipangizo zonyenga pagawo linalake lopangira kuti titsimikizire zotsatira zake.


Nthawi yotumizira: Januwale-17-2022
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