Ci-gaba mai ramuka yumbu injin injin Chuck

Ci-gaba mai ramuka yumbu injin injin Chuck
Porous Yumbu injin Chuckwani dandali ne mai ɗauke da kaya wanda ke amfani da ƙa'idar shaƙar injin don gyara kayan aikin. Sashen injin da ke watsa injin shine farantin yumbu mai ramuka. Ana haɗa farantin yumbu mai ramuka a cikin ramin nutsewa na tushe, kuma an haɗa gefensa kuma an rufe shi da tushe. An yi tushen da kayan yumbu ko ƙarfe masu daidaito. Ta hanyar haɗa tushen ƙarfe ko yumbu tare da yumbu mai ramuka na musamman, ƙirar hanyar iska ta ciki tana ba da damar mannewa mai santsi da kwanciyar hankali na kayan aikin zuwa kofin tsotsar injin lokacin da aka fuskanci matsin lamba mara kyau.

Saboda ƙananan ramukan da ke cikin yumbu mai ramuka, ana iya manne saman kayan aikin a cikin kofin tsotsar iska ba tare da wani mummunan abu kamar ƙage ko ɓarna da matsin lamba ya haifar ba.

Halaye na porous yumbu injin Chuck:
① Tsarin tsari mai yawa da daidaito: Yana jure wa sharar silicon/nika tarkace, mai sauƙin tsaftacewa.
② Babban ƙarfi & juriya ga lalacewa: Babu nakasa yayin niƙa, yana rage guntuwar gefuna/raguwa.
③ Tsawon rai: Kyakkyawan riƙe siffar saman, tsawon lokacin da aka ɗauka ba tare da cirewa ba.
④ Babban rufi: Yana kawar da wutar lantarki mai tsauri.
⑤ Mai sake amfani da shi & mai sauƙin sakawa: Babu fashewa/cizon abu yayin sake gyarawa, ana iya sake amfani da shi sau da yawa.
⑥ Ba ya ƙura da kuma karko: An cika shi da sinadari, babu wani hayaki mai gurbata muhalli.
⑦ Mai Sauƙi: Tsarin ramuka yana rage nauyi sosai.
⑧ Juriyar sinadarai: Ana iya keɓance shi don yanayin lalata ta hanyar sarrafa kayan aiki/tsarin aiki.

Yumbu injin Chuck VS Traditional Metal Tsotsa Cup:

Chuck injin yumbu na yumbu a cikin filin semiconductor
Kayan aikin matsewa da ɗaukar kayan aiki na yumbu na yumbu suna aiki azaman kayan aiki na ɗaurewa da ɗaukar kaya a cikin samar da wafer na semiconductor. Suna da babban lanƙwasa da daidaituwa, tsari mai yawa da daidaito, ƙarfi mai yawa, iska mai kyau, ƙarfin shawa iri ɗaya, da sauƙin haɗawa. Waɗannan halaye sun sa su dace da hanyoyin ƙera wafer na semiconductor kamar rage nauyi, yankewa, niƙawa, tsaftacewa, da sarrafawa. Suna magance ƙalubale kamar buguwa ta wafer, fashewar guntu ta lantarki, da gurɓatar barbashi, suna samun ingantaccen ingancin sarrafawa ga wafer na semiconductor a aikace-aikace masu amfani.