I-Dual-Damascene yiteknoloji yenkqubo esetyenziselwa ukwenza ii-metal interconnects kwiisekethe ezidibeneyo. Luphuhliso olongezelelekileyo lwenkqubo yaseDamasko. Ngokwenza imingxunya kunye nee-grooves ngaxeshanye kwinyathelo elifanayo lenkqubo kwaye uzizalise ngesinyithi, ukwenziwa okudibeneyo kwee-metal interconnects kuyafezekiswa.
Kutheni ibizwa ngokuba yiDamasko?
Isixeko saseDamasko likomkhulu laseSiriya, kwaye amakrele aseDamasko adumile ngobukhali bawo kunye nobume bawo obuhle. Uhlobo lwenkqubo yokufaka intsimbi luyafuneka: okokuqala, ipateni efunekayo iqoshwe kumphezulu wentsimbi yaseDamasko, kwaye izinto ezilungiselelwe kwangaphambili zigqunywe ngokuqinileyo kwimigca eqingqiweyo. Emva kokuba i-inlay igqityiwe, umphezulu unokuba ungalingani kancinci. Ingcibi iya kuwucoca ngononophelo ukuqinisekisa ukuba ubushelelezi ngokubanzi. Kwaye le nkqubo yiprototype yenkqubo yeDamasko ezimbini zetship. Okokuqala, imingxunya okanye imingxuma iqoshwe kumaleko we-dielectric, kwaye emva koko isinyithi siyazaliswa kuyo. Emva kokuzaliswa, isinyithi esingaphezulu siya kususwa nge-cmp.
Amanyathelo aphambili enkqubo ye-damascene ephindwe kabini aquka:
▪ Ukususwa komaleko we-dielectric:
Beka umaleko wezinto ze-dielectric, ezifana ne-silicon dioxide (SiO2), kwi-semiconductori-wafer.
▪ Ifotolithography ukuchaza ipateni:
Sebenzisa i-photolithography ukuchaza ipateni yee-vias kunye nee-trenches kumaleko we-dielectric.
▪Ukukrola:
Dlulisa ipateni yee-vias kunye neetrenches kumaleko we-dielectric ngenkqubo yokukrola eyomileyo okanye emanzi.
▪ Ukususwa kwesinyithi:
Faka isinyithi, esifana nobhedu (Cu) okanye i-aluminium (Al), kwii-vias kunye nemisele ukuze wenze uqhagamshelo lwesinyithi.
▪ Ukupholisha ngoomatshini ngekhemikhali:
Ukupholishwa ngoomatshini komphezulu wesinyithi ngekhemikhali ukuze kususwe isinyithi esigqithisileyo kwaye kuthambe umphezulu.
Xa kuthelekiswa nenkqubo yemveli yokwenziwa koqhagamshelwano lwesinyithi, inkqubo ye-dual damascene inezi nzuzo zilandelayo:
▪Amanyathelo enkqubo elula:ngokwenza ii-vias kunye nee-trenches ngaxeshanye kwinqanaba elifanayo lenkqubo, amanyathelo enkqubo kunye nexesha lokuvelisa ziyancitshiswa.
▪Ukuphuculwa kokusebenza kakuhle kwemveliso:Ngenxa yokuncipha kwamanyathelo enkqubo, inkqubo ye-damascene ephindwe kabini inokuphucula ukusebenza kakuhle kwemveliso kwaye inciphise iindleko zemveliso.
▪Ukuphucula ukusebenza kwee-metal interconnects:Inkqubo ye-damascene ephindwe kabini inokufezekisa uqhagamshelo lwesinyithi oluncinci, ngaloo ndlela iphucula ukuhlanganiswa kunye nokusebenza kweesekethe.
▪Nciphisa amandla kunye nokumelana nezinambuzane:ngokusebenzisa izixhobo ze-dielectric eziphantsi kwe-k kunye nokwenza ngcono ulwakhiwo lwe-metal interconnects, amandla kunye nokumelana kwe-parasitic kunokunciphisa, okuphucula isantya kunye nokusebenza kwamandla kweesekethe.
Ixesha leposi: Novemba-25-2024