Ulwakhiwo lwangaphakathi lwezixhobo zetyhubhu yesithando luchazwe ngokweenkcukacha

Njengoko kubonisiwe apha ngasentla, yinto eqhelekileyo

Isiqingatha sokuqala:

▪ Isixhobo sokufudumeza (i-heating coil):

ibekwe kufutshane netyhubhu yesithando somlilo, edla ngokwenziwa ngeengcingo zokumelana, ezisetyenziselwa ukufudumeza ngaphakathi kwetyhubhu yesithando somlilo.

▪ Umbhobho weQuartz:

Ingaphakathi lesithando somlilo esishushu, esenziwe nge-quartz ecocekileyo kakhulu enokumelana namaqondo obushushu aphezulu kwaye ihlale ingangenisi khemikhali.

▪ Ukutya kweGesi:

Ifumaneka phezulu okanye ecaleni kwetyhubhu yesithando somlilo, isetyenziselwa ukuthutha ioksijini okanye ezinye iigesi ngaphakathi kwetyhubhu yesithando somlilo.

▪ I-SS Flange:

izinto ezidibanisa iityhubhu ze-quartz kunye nemigca yegesi, ukuqinisekisa ukuqina kunye nozinzo lonxibelelwano.

▪ Iintambo Zokuhambisa Igesi:

Iipayipi ezidibanisa i-MFC kwizibuko lokuhambisa igesi ukuze kudluliselwe igesi.

▪ I-MFC (uMlawuli wokuhamba kobuninzi):

Isixhobo esilawula ukuhamba kwegesi ngaphakathi kwityhubhu ye-quartz ukuze silawule ngokuchanekileyo ubungakanani begesi efunekayo.

▪ Umoya wokungenisa umoya:

Isetyenziselwa ukukhupha igesi yokukhupha umoya ngaphakathi kwityhubhu yesithando somlilo ukuya ngaphandle kwesixhobo.

Inxalenye esezantsi:

▪ IiWafer zeSilicon ezikwiSibambi:

Ii-silicon wafers zigcinwa kwi-Holder ekhethekileyo ukuqinisekisa ubushushu obufanayo ngexesha le-oxidation.

▪ Isibambi seWafer:

Isetyenziselwa ukubamba i-silicon wafer nokuqinisekisa ukuba i-silicon wafer ihlala izinzile ngexesha lenkqubo.

▪ Isiseko seenyawo:

Isakhiwo esibamba i-silicon wafer Holder, esidla ngokwenziwa ngezinto ezimelana nobushushu obuphezulu.

▪ Ilifti:

Isetyenziselwa ukuphakamisa izibambi zeWafer zingena kwaye ziphuma kwiityhubhu zequartz ukuze zilayishwe kwaye zikhutshwe ngokuzenzekelayo kwiiwafer zesilicon.

▪ Irobhothi Yokudlulisa I-Wafer:

ibekwe ecaleni kwesixhobo setyhubhu yesithando somlilo, isetyenziselwa ukususa ngokuzenzekelayo i-silicon wafer ebhokisini ize ibekwe kwityhubhu yesithando somlilo, okanye isuswe emva kokucutshungulwa.

▪ Ikharousel yokugcina iikhasethi:

Ikhaseti yokugcina iikhaseti isetyenziselwa ukugcina ibhokisi enee-silicon wafers kwaye ingajikeleziswa ukuze ifikelele kwirobhothi.

▪ Ikhasethi yeWafer:

Ikhasethi ye-wafer isetyenziselwa ukugcina nokuhambisa ii-wafer ze-silicon eziza kucutshungulwa.