Njengoba kuboniswe ngenhla, kuyinto evamile
Ingxenye yokuqala:
▪ Isici Sokushisa (ikhoyili yokushisa):
itholakala eduze kwepayipi lesithando, ngokuvamile elenziwe ngezintambo zokumelana, ezisetshenziselwa ukushisa ingaphakathi lepayipi lesithando.
▪ Ishubhu le-Quartz:
Ingaphakathi lesithando esishisayo se-oxidation, esenziwe nge-quartz emsulwa kakhulu engamelana namazinga okushisa aphezulu futhi ihlale ingangeni makhemikhali.
▪ Ukudla Kwegesi:
Itholakala engxenyeni engenhla noma ohlangothini lweshubhu lesithando, isetshenziselwa ukuthutha umoya-mpilo noma amanye amagesi ngaphakathi kweshubhu lesithando.
▪ I-SS Flange:
izingxenye ezixhumanisa amashubhu e-quartz kanye nemigqa yegesi, okuqinisekisa ukuqina nokuqina koxhumano.
▪ Imizila Yokuphakela Igesi:
Amapayipi axhumanisa i-MFC nechweba lokuphakelwa kwegesi ukuze kudluliselwe igesi.
▪ I-MFC (Umlawuli Wokugeleza Okukhulu):
Idivayisi elawula ukugeleza kwegesi ngaphakathi kwepayipi le-quartz ukuze ilawule ngokunembile inani legesi elidingekayo.
▪ Umoya wokungenisa umoya:
Isetshenziselwa ukukhipha igesi yokukhipha umoya ngaphakathi kwepayipi lesithando iye ngaphandle kwemishini.
Ingxenye engezansi:
▪ Ama-Silicon Wafers Asesibambisweni:
Ama-wafer e-silicon afakwa ku-Holder ekhethekile ukuqinisekisa ukushisa okufanayo ngesikhathi sokushiswa kwe-oxidation.
▪ Isibambi Se-Wafer:
Isetshenziselwa ukubamba i-silicon wafer nokuqinisekisa ukuthi i-silicon wafer ihlala izinzile phakathi nenqubo.
▪ Isisekelo:
Isakhiwo esibamba i-silicon wafer Holder, ngokuvamile esenziwe ngezinto ezimelana nokushisa okuphezulu.
▪ Ilifti:
Isetshenziselwa ukuphakamisa izibambo ze-Wafer zingene futhi ziphume kumashubhu e-quartz ukuze zilayishwe futhi zithululwe ngokuzenzakalelayo ama-wafer e-silicon.
▪ Irobhothi Lokudlulisa I-Wafer:
itholakala ohlangothini lwedivayisi yeshubhu lesithando, isetshenziselwa ukususa ngokuzenzakalelayo i-silicon wafer ebhokisini bese ifakwa eshubhu lesithando, noma ukuyisusa ngemva kokucutshungulwa.
▪ I-Carousel Yokugcina Amakhasethi:
I-carousel yokugcina amakhasethi isetshenziselwa ukugcina ibhokisi eliqukethe ama-wafer e-silicon futhi ingajikeleziswa ukuze kufinyelelwe ku-robot.
▪ Ikhasethi Yesitsha Esiyisikwele:
Ikhasethi ye-wafer isetshenziselwa ukugcina nokudlulisa ama-wafer e-silicon ukuze acutshungulwe.
Isikhathi sokuthunyelwe: Ephreli-22-2024
