Indandatho yeGraphite Ehlanganisiwe yeTantalum Carbide Enezimbobo

Indandatho yeGraphite Ehlanganisiwe yeTantalum Carbide Enezimbobo
I-graphite embozwe nge-tantalum carbide (TaC) enezimbobokuyinto ebalulekile eyenzelwe ngqo izindawo ezishisa kakhulu nezigqwala kakhulu zokukhiqiza i-semiconductor. I-substrate yayo iyi-graphite emsulwa kakhulu, embozwe nge-tantalum carbide coating evuvukayo efanayo kusetshenziswa i-chemical vapor deposition (CVD). I-TaC inobunzima obuphezulu kakhulu (9-10 esikalini se-Mohs) kanye nendawo yokuncibilika engu-3880°C. Ihlanganiswe nokuzinza okuhle kakhulu kokushisa kwe-graphite kanye nezakhiwo ezilula, le nto ihlanganisa amandla okushisa aphezulu nokumelana nokuhlaselwa ngamakhemikhali kanye nokushaqeka kokushisa, okwenza kube ukukhetha okuhle kwemishini yenqubo ye-semiconductor esebenza ngaphansi kwezimo ezimbi kakhulu.

Izinzuzo ze-Graphite ye-Tantalum Carbide enezimbobo:
1. Ukumelana Nokugqwala Okuphezulu Kakhulu
-I-TaC ayisebenzi ngamakhemikhali, imelana ngempumelelo nokugqwala okuvela kuma-halogens afana ne-fluorine ne-chlorine, okwandisa kakhulu isikhathi sokuphila kwemishini.
-Isakhiwo esinezimbobo sandisa indawo yobuso bengubo, sakha isithiyo esivikelayo esiqinile futhi sinciphise ingozi yokuchitheka kwezinhlayiya.
2. Ukuqina Okuhle Kakhulu Kokushisa Okuphezulu
-Njengoba iphuzu lokuncibilika lisondela ku-4000°C, lingasebenza isikhathi eside ezindaweni ezingenalutho noma ezishisayo ezingaphezu kuka-2500°C.
-I-coefficient yokwandisa ukushisa kwengubo ifana kakhulu neye-graphite, ivimbela ukuqhekeka kanye nokwehlukaniswa okubangelwa ukujikeleza kokushisa.
3. Ukuhlanzeka Okuphezulu Nokungcola Okuphansi
-Kusetshenziswa izinto zokusetshenziswa kanye nezinqubo zezinga le-semiconductor, okuqukethwe kokungcola kwensimbi kuphansi kakhulu, okunciphisa kakhulu ingozi yokungcoliswa kwe-wafer.
-Ubuso buqinile futhi buzinzile ngamakhemikhali, kunciphisa ukukhiqizwa kwezinhlayiya futhi kuhlangabezana nezindinganiso eziqinile zegumbi lokuhlanza.
4. Umklamo Owenziwe Ngokwezifiso
Izimo eziyinkimbinkimbi zingakhiqizwa ngokwemidwebo yamakhasimende, futhi ukujiya kwe-porosity kanye nobukhulu be-coating kungalawulwa ukuze kufezwe ukugeleza kwegesi okuhle kakhulu kanye nokuqhuba ukushisa.
5. Isikhathi Eside Sokuphila Nezindleko Zokulungisa Eziphansi
Ukugqwala okuphezulu kakhulu kanye nokumelana nokuguguleka kwezembozo ze-TaC ezinezimbobo kwandisa impilo yezingxenye ngokuphindwe ka-3-5 uma kuqhathaniswa ne-graphite yendabuko, okunciphisa imvamisa yokushintsha kanye nezindleko zokulungisa.

Izinhlelo Eziyinhloko
1. Izingxenye eziyinhloko zokukhiqiza i-wafer
- Ama-liners egumbi lokusabela, ama-baffle, kanye ne-shower-head yemishini ye-CVD/ALD
- Ukusekelwa kwe-PVD okuqondiwe
- Izingxenye zenqubo yokushisa okuphezulu zokusabalalisa, ukuxiliswa, ukufakelwa, nezinye izinqubo
2. Izinhlelo zokufaka umusi wamakhemikhali
- Ukuvikela izingxenye ezibalulekile ezindaweni ezigqwala kakhulu (njenge-fluoride nama-chloride) phakathi nenqubo
3. Ezinye izindawo ezigqwalisayo ezinokushisa okuphezulu
- Ifanele ukuhlanzwa kwegesi ngamakhemikhali, izitofu ezikhethekile zokwelapha ukushisa, kanye nezinye izinhlelo zokusebenza.